Murata Manufacturing Co., Ltd.

Motoji Tsuda

Takanori Uejima

Yukiya Yamaguchi

Yuji Takematsu

Yutaka Sasaki

Takayuki Nakamura

Naoya Matsumoto

Mitsunori Samata

Dai Nakagawa

Mitsuyoshi Hira

Daerok Oh

Masahide Takebe

Katsunari Nakazawa

Morio Takeuchi

Tetsuro Harada

Yoshiaki Sukemori

Seiji Kai

Atsushi Horita

Hayato Nakamura

Yusuke Naniwa

Jin Yokoyama

Hiroyuki Kani

Sho Matsumoto

Yuuki Fukuda

Yuki Fukuda

Hiromichi Kitajima

Satoshi Arayashiki

Satoshi Goto

Syunsuke Kido

Taku Kikuchi

Masayuki Aoike

Takashi Yamada

Kunitoshi Hanaoka

Kiyoshi Aikawa

Shunji Yoshimi

Toru Takeshita

Shou Matsumoto

Kenta Kurahashi

Hiroki Fujiwara

Takashi Naka

Mayuka Ono

An integrated circuit includes a first base that has at least a part formed of a first semiconductor material and that includes an electric circuit, a second base that has at least a part formed of a second semiconductor material having a thermal conductivity lower than the first semiconductor material and that includes a power amplifier circuit, and a high thermal conductive member that has at least a part formed of a high thermal conductive material having a thermal conductivity higher than the first semiconductor material and that is disposed between the electric circuit and the power amplifier circuit. At least a part of the high thermal conductive member overlaps at least a part of the first base and at least a part of the second base in plan view. The high thermal conductive member is in contact with the first base and the second base.

Integrated circuit and radio-frequency module

In a radio-frequency module, a conductive layer covers a major surface opposite to the mounting board side of a resin layer and a major surface opposite to the mounting board side of an electronic component. The electronic component includes an electronic component body and a plurality of outer electrodes. The electronic component body includes an electrical insulating portion and a conductive portion provided inside the electrical insulating portion, forming at least a portion of a circuit element of the electronic component. The electronic component body has a third major surface and a fourth major surface opposite to each other, and an outer side surface. The third major surface forms the major surface of the electronic component, and the third major surface is in contact with the conductive layer. The plurality of outer electrodes are provided on the fourth major surface, but are not extended over the third major surface.

Radio-frequency module and communication device

A radio-frequency module includes a first base, which has at least a part formed of a first semiconductor material and which includes a low-noise amplifier circuit, a second base, which has at least a part formed of a second semiconductor material having a thermal conductivity lower than that of the first semiconductor material and which includes a power amplifier circuit, and a module substrate, which has a principal surface on which the first base and the second base are disposed. The first base is joined to the principal surface with electrodes interposed in between. The second base is disposed between the module substrate and the first base in cross-sectional view, and is joined to the principal surface with an electrode interposed in between. At least a part of the first base overlaps at least a part of the second base in plan view.

A radio-frequency module includes a power amplifier, a power amplifier, a low noise amplifier, a duplexer that has a passband including a communication band A included in a communication band group X and that is connected to the power amplifier and the low noise amplifier, a duplexer that has a passband including a communication band C included in a communication band group Y lower than the communication band group X and that is connected to the power amplifier, and a module substrate having the power amplifier, the power amplifier, the low noise amplifier, and the duplexers arranged thereon. In a plan view of the module substrate, a distance between the power amplifier and the low noise amplifier is longer than a distance between the power amplifier and the low noise amplifier.

Radio-frequency module

A radio frequency module includes a module substrate; a power amplifier disposed on or over the module substrate, amplifies a radio frequency signal, and outputs the amplified radio frequency signal as the first transmission signal; a power amplifier disposed on or over the module substrate, amplifies a radio frequency signal, and outputs the amplified radio frequency signal as the second transmission signal; a temperature sensor disposed on or over the module substrate; and a PA control circuit disposed on or over the module substrate and controls amplification operations of the power amplifiers according to a measurement value of the temperature sensor. The maximum output power of the power amplifier is greater than the maximum output power of the power amplifier, and the distance between the temperature sensor and the power amplifier is less than or equal to the distance between the temperature sensor and the power amplifier.

Radio frequency module and communication device

A high-frequency circuit includes a power amplifier for a communication band A, and a power amplifier for a communication band B. Transmission in the communication band A, transmission in the communication band B, and reception in the communication band C can be simultaneously used. A frequency range of intermodulation distortion generated between a second harmonic wave of a transmission signal of the communication band A and a fundamental wave of a transmission signal of the communication band B, overlaps with at least part of a reception band of the communication band C. The power amplifier includes amplifying elements and an output trans including coils. One end of the coil is connected with an output of the amplifying element, the other end of the coil is connected with an output of the amplifying element, and one end of the coil is connected with an output terminal of the power amplifier.

High-frequency circuit and communication device

A radio-frequency module () includes a module substrate () having major surfaces (and) opposite to each other, external connection terminals (and) disposed on the major surface (), a power amplifier () having major surfaces (and) opposite to each other and being disposed on the major surface () such that the major surface () is a mounting surface on the module substrate (), a bonding wire () coupled to the major surface (), and a heat dissipation electrode () disposed apart from the power amplifier () on the major surface () side with respect to the power amplifier () and coupled to the bonding wire ().

A radio frequency module includes a substrate, a power amplifier that amplifies a transmission signal in a first communication band, a power amplifier that amplifies a transmission signal in a second communication band, and a power amplifier that amplifies a transmission signal in a third communication band. Simultaneous transmission can be performed in a combination of the first communication band and the third communication band. Simultaneous transmission cannot be performed in a combination of the first communication band and the second communication band and a combination of the second communication band and the third communication band. In plan view of the substrate, a distance between the output terminals of the power amplifier and the power amplifier is longer than a distance between the output terminals of the power amplifier and the power amplifier and a distance between the output terminals of the power amplifier and the power amplifier.

A high-frequency front end module includes a primary antenna terminal and a secondary antenna terminal, a first multiplexer and a second multiplexer, a switch circuit, and a first amplifier and a second amplifier. The first multiplexer has a first transmission filter and a first reception filter. The second multiplexer has a second transmission filter and a second reception filter. The switch circuit exclusively switches connection between the primary antenna terminal and the first multiplexer and connection between the primary antenna terminal and the second multiplexer, and exclusively switches connection between the secondary antenna terminal and the first multiplexer and connection between the secondary antenna terminal and the second multiplexer.

High-frequency front end module and communication device

A high-frequency module includes a mounting substrate having main surfacesanda first circuit component mounted on the main surfacea second circuit component mounted on the main surfacean external connection terminal arranged on the main surfaceside relative to the main surfacewith respect to the mounting substrate, a long via conductor connected to the first circuit component, passing through the mounting substrate, and having a substantially long shape when the mounting substrate is viewed in a plan view, and a metal block arranged on the main surfaceside relative to the main surfacewith respect to the mounting substrate and connecting the long via conductor and the external connection terminal. When the mounting substrate is viewed in a plan view, the first circuit component overlaps the long via conductor and the metal block overlaps the long via conductor.

High-frequency module and communication apparatus

A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides; a transmission input terminal; a transmission power amplifier that amplifies a transmission signal input from the transmission input terminal; a switch that switches between connecting and disconnecting the transmission input terminal and the transmission power amplifier, and a control circuit that controls the transmission power amplifier using digital control signals. The switch is disposed on the first principal surface, and the control circuit is disposed on the second principal surface.

A radio-frequency module includes a switch performing switching of the connection between a common terminal and a selection terminal, a reception filter having a reception band in a band A as a passband, a transmission filter that has a transmission band in a band B as a passband and has an output terminal connected to the selection terminal, a filter that has the transmission band in a band B as an attenuation band and has an input terminal connected to the selection terminal, a reception path which connects the selection terminal and an input terminal of the reception filter and on which the filter is disposed, a bypass path which connects the selection terminal and the input terminal of the reception filter and on which no filter is disposed, and a transmission path which connects the selection terminal and a transmission terminal and on which the transmission filter is disposed.

A radio-frequency module includes a transmission path which has one end connected to a transmission terminal and on which a transmission signal in Band A is transmitted; a reception path () which has one end connected to a reception terminal (B) and on which a reception signal in Band B is transmitted; a reception path () which has one end connected to a reception terminal (C) and on which a reception signal in Band C is transmitted; a switch () having a common terminal () and selection terminals (and); and a switch () having a common terminal () and selection terminals (and).

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Nagaokakyo, Japan

Motoji Tsuda