Sharp Kabushiki Kaisha Corporation

Motoji Shiota

Takashi Matsui

Yukio Shimizu

Hirokazu Yoshida

Kiyoshi Inada

Hiroki Miyazaki

Seiji Muraoka

Yasunori Chikawa

Atsushi Ono

Akio Inohara

Takeshi Horiguchi

Gen Nagaoka

Satoru Tone

Masaki Nakayama

Makoto Kanda

Hiroki Nakahama

Norimitsu Nie

Keiji Aota

Yasuhiko Tanaka

Yasunobu Tagusa

Takatoshi Kira

Toshiaki Fujihara

Yasuhiro Hida

Ichiro Umekawa

Hiroki Makino

Makoto Tamaki

Keigo Aoki

Minoru Horino

Tohru Arima

Takayuki Kanaya

Hiroki Kawamura

A display device is provided with a first adhesive layer formed on a sealing layer in a display region and a flexible sheet formed on a resin layer on an opposite side of a TFT layer, in which a first inorganic insulating layer has a first slit, the flexible sheet has a second slit, and the first adhesive layer is formed in a state of extending from the display region to a frame region, and overlapping with the first slit and the second slit.

Display device and method for manufacturing display device

Provided is connection wiring capable of inhibiting connection defects between bumps and pads at the time of semiconductor chip mounting and also allowing an increase in the number of pads. In an area between a pad row in any stage and a pad row in an adjacent stage, a first lineis disposed so as to pass under an adjacent second line, or a second lineis disposed so as to pass over an adjacent first line. In this case, three lines are disposed in any area between padsin each stage such that the three lines include a first linesituated in the middle, and second linesare situated so as to have the first linepositioned therebetween. Thus, the pitch between the padscan be further reduced without reducing the width of the pads

Connection wiring

A display device includes a TFT layer provided in a display area, a bending section and a terminal in a non-active area, and a terminal wiring line that connects to the terminal through the bending section, and the terminal wiring line includes a first wiring line and a second wiring line each positioned on both sides of the bending section and a third wiring line that passes through the bending section and is electrically connected with each of the first wiring line and the second wiring line and curved so as to have recesses and protrusions.

Display device

In order to inhibit defective connection between a bump of a semiconductor chip and an electrode pad of a substrate, a semiconductor device includes a substrate provided on a surface with a plurality of electrode pads, a semiconductor chipprovided on a surface with a plurality of bumpssubstantially equal in size, and an anisotropic conductive filminterposed between the plurality of bumpsand the plurality of electrode padsand electrically connecting each of the bumpsand corresponding one of the electrode pads. The plurality of electrode padsincludes a plurality of first electrode padsA positioned closest to an endof the semiconductor chip, and a plurality of second electrode padsB positioned inside the plurality of first electrode padsA on the semiconductor chip. Each of the second electrode padsB is larger in area than each of the first electrode padsA.

Semiconductor device

An array circuit boardB includes a glass substrate, an IC chip, two ACFs, and a resin film. The IC chipis disposed on the glass substrate. The ACFsare disposed between the glass substrate and the IC chipfor electrically connecting the glass substrate and the IC chiptogether. The ACFsare separated from each other. The resin filmis made of resin material having cure shrinkage smaller than the ACFsand disposed to fill a gap between the ACFsadjacent to each other between the glass substrate and the IC chip

Circuit board, display panel, and display device

A display apparatus is provided with: a frame; a display panel, which is fixed to the frame; and a plurality of flexible printed circuit boards, which are disposed adjacent to each other, and each of which has one end side pressure bonded to the display panel, and the other end side bent to the frame side, which is the reverse side of the display panel. The display apparatus has adhesive areas wherein a surface of the display panel is adhered and fixed to the frame, the adhesive areas being in areas overlapping the flexible printed circuit boards. In regions among the flexible printed circuit boards adjacent to each other, non-adhesive areas where the surface of the display panel is not adhered and fixed to the frame are provided.

Display apparatus

This drive chip has a configuration that is provided with: a base main body; two terminal groups that are respectively disposed along the base main body sides in the longitudinal direction of the base main body, said sides facing each other; a narrow-pitch section in one terminal group wherein terminals are disposed in a zigzag manner in two or more rows, said narrow-pitch section having a narrow terminal pitch in the longitudinal direction; a rough pitch section in the one terminal group, said rough pitch section having a terminal pitch in the longitudinal direction wider than that of the narrow pitch section; and a dummy bump that is disposed between the two terminal groups, said dummy bump being disposed parallel to the rough pitch section.

Drive chip and display apparatus

A liquid crystal display device includes: a liquid crystal panel having a display area and non-display area; a flexible substrate in the non-display area and connected to a control circuit substrate; a plurality of drivers in the non-display area; a plurality of connection wiring lines in the non-display area for connecting the flexible substrate to the plurality of drivers; a first driver; a second driver that is arranged further away from the flexible substrate than the first driver; a non-overlapping connection wiring line that connects the second driver to the flexible substrate and that does not overlap the first driver; and an overlapping connection wiring line that connects the second driver to the flexible substrate and that has a least a portion thereof overlapping the first driver.

A display moduleof the present invention includes a first board, a second board, a base film, and a circuit member. The first boardand the second boardare bonded together to face with each other. The base filmis provided between the first boardand the second boardand extends outwardly from an end of the first board. The base filmhas an insulating property and the extended portion is bent to an outer surface side of one of the first boardand the second board. The circuit memberis formed on the base film

Display module and display device

A wiring substrate () includes: a substrate; and, formed upon the substrate, a plurality of wiring lines, a plurality of circuit elements, and a plurality of connecting terminals () connected via the plurality of wiring lines. Each of the plurality of connecting terminals () includes a pair of protrusion parts (), forming a depression part () between the pair of protrusion parts (), and a depression electrode () that is disposed in the depression part () and that at least partially covers each protrusion of the pair of protrusion parts ().

Electronic circuit substrate, display device, and wiring substrate

A liquid crystal display device () includes a glass substrate () having an LSI chip () and an FPC board () mounted thereon. A component ACF () made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors () on the glass substrate (). The component ACF () has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip () and the FPC board () which are mounted first. By thus using the large component ACF (), a positional constraint upon adhering the component ACF () to the glass substrate () is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.

Board module and method of manufacturing same

A drive IC chip () including a circuit for driving a display region () is mounted on a panel substrate (). An anisotropic conductive film () is interposed between the panel substrate () and the drive IC chip () and electrically connects the bump electrodes () of the drive IC chip () and the electrode pads () of the panel substrate (). The anisotropic conductive film () is arranged to extend beyond all side surfaces (to) other than one specific side surface () of the drive IC chip ().

Display panel and display device including the same

A wiring board of the present invention () is arranged so that: pads () arranged in a plurality of rows include: first-row pads () connected to first metal wires () among metal wires (); and second-row pads () connected to second metal wires () among the metal wires (), the first metal wires () being longer than the second metal wires (); each of the first metal wires () is formed so as to be separated from a corresponding one of the second-row pads () by at least an insulating layer, and so as to have a widthwise center in a lower region below the corresponding second-row pad (); and each of the first metal wires () has widthwise edges provided, in a plan view, beyond widthwise edges of a corresponding one of the second-row pads () in a region in which the first metal wire () overlaps with the corresponding second-row pad ().

Wiring board and liquid crystal display device

A wiring board of the present invention has pads disposed in a plurality of rows including: first row pads each being connected to a respective one of the connection wires that is long in length; and second row pads () each being connected to a respective one of the connection wires that is shorter in length than that of first connection wires () connected to the first row pads, each of the first connection wires () being provided not in a region between adjacent ones of the second row pads () but in a lower layer region of the second row pads (), in such a manner that at least a first insulating layer () is sandwiched between the second row pads () and the first connection wires (), and 0.8&#x2266;W/W1, where Wis a line width of the first connection wires () in the lower layer region of the second row pads (), and Wis a width of the second row pads ().

Provided is a semiconductor element in which decrease in reliability of wiring is suppressed. A driver IC () has a plurality of output bumps () arranged in the direction (direction A) along the long sides (and). The output bumps include a plurality of source bumps () arranged near the center section of the long side, and a plurality of gate bumps () arranged towards the end portions of the long side. The source bumps are arranged close to the long side (), and the gate bumps are arranged closer to the long side () than the source bumps.

Growing community of inventors

Osaka, Japan

Motoji Shiota