Fujitsu Corporation

Fujitsu Limied

Motoichi Watanuki

Yoshiaki Yanagida

Tomokazu Sugiyama

Kazuo Yokoi

Koji Suto

Naohisa Matsushita

Hiroyuki Nakajima

Nobuo Iijima

Mitsumasa Oshiki

The method of manufacturing a magnetic head is capable of correctly setting a raw bar, which includes small sliders, on to a supporting jig, machining the raw bars precisely and improving yield of manufacturing sliders. The method comprises the steps of forming a magnetizable layer, on a surface of a substrate whose thickness is greater than a length of said slider; and cutting said wafer into a raw bar after forming the layers.

Method of manufacturing magnetic head

The method of the present invention is capable of manufacturing a thin film head, which includes a protection layer having enough corrosion-resisting property and water-repellent property, which is capable of keeping the magnetic head clean even if temperature and humidity are high, and which has enough durability and reliability. The method of manufacturing the thin film head, in which a pad, which contacts a disk, and a floating pattern are formed in a disk-side face, comprises the steps of: forming a adhesion layer on the disk-side face of a substrate, which is a main body of the thin film head; forming a protection layer on the adhesion layer; coating the protection layer with resist; patterning the resist so as to form a pad hole at a prescribed position, at which the pad is formed; forming a pad film on resist-coated faces including an inner face of the pad hole; and lifting off the resist so as to form the pad.

Method of manufacturing thin film head

The method of manufacturing a magnetic head comprises the steps of: forming a plurality of layers, which are made from prescribed materials, on a substrate; and forming a plurality of magnetic head elements on the substrate. Using a first ELG element whose size in a prescribed direction is bigger than that of the magnetic head elements and a second ELG element whose size is equal to that of the magnetic head elements, on the substrate, a work piece is lapped, while monitoring resistance of the first ELG element when the resistance of the first ELG element reaches a prescribed value, the amount of lapping the work piece is adjusted on the basis of resistance of the second ELG element Thus, a bar-shaped member can be precisely lapped, the magnetic heads can be manufactured without scattering their characteristics, and yield rate of manufacturing can be improved.

The grinding machine and the method of grinding are capable of grinding a bar member for a magnetic head with higher grinding accuracy. In the grinding machine, a holding frame holds a bar member and heads a first face of the bar member, which is to be ground, downward. A grinding plate grinds the first face of the bar member. An actuator presses a second face of the bar member held by the holding frame so as to press the first face onto the grinding plate. A resistance monitor monitors a resistance value of a sensing part of an ELG element section of the bar member so as to adjust a strip height of a magnetic head section of the bar member.

Grinding machine for grinding bar member for magnetic head and method of grinding the same

Disclosed is a magnetic head manufacturing method for accurately measuring resistance value whereby magnetic heads are processed while measuring the resistance values of process monitoring element. After forming on a wafer magnetic head elements and monitoring element, in which resistance values change in analog fashion in line with processing, these elements are cut from the wafer. Next, the magnetic heads are processed to a prescribed height while measuring the resistance values of the monitoring element. In the forming process, the difference &Dgr;I between the positions of the magnetic head elements and monitoring element is measured in advance, and this difference &Dgr;I is used to convert the resistance values of the monitoring element to the height of the magnetic head elements. This makes it possible to correct errors in masks. Furthermore, patterns can be formed accurately by setting the position of the monitoring element to the same position as the magnetoresistive film of the magnetic heads.

Manufacturing method for magnetic heads

The method of manufacturing a magnetic head is capable of preventing element sections from being damaged by static electricity and which is capable of keeping prescribed characteristics of the magnetic head. The method of the present invention comprises the steps of: forming film layers on a surface of a substrate; etching the film layers to form into prescribed patterns; and forming an element section having prescribed characteristics, wherein a specific section of the substrate, in which the element section is formed, is enclosed by electric conductive film.

Prevention of damage due to static electricity during manufacturing of magnetic head

The present invention relates to an automatic lapping method for lapping a work piece and a lapping apparatus using the same. The lapping apparatus laps a work piece by moving the mounting base,relatively to a lapping plate,. On a coarse processing step, the lapping plate,is controlled with high speed as detecting a remaining amount for lapping the work piece. Then, on a fine processing step, said lapping plate,is controlled with low speed by detecting that the remaining amount h for lapping said work piece has reached to a predetermined amount H,. Thereby, it becomes possible to continuously execute the coarse processing and the fine processing in one lapping apparatus.

Automatic lapping method and a lapping apparatus using the same

In this method of manufacturing magnetic head elements, the width of the ELG elements can be narrower and the number of magnetic head elements manufactured can be increased. The method includes the steps of: lapping a bar-shaped member in which magnetic head element sections and ELG elements are alternately formed; monitoring resistance of the ELG elements; and removing the ELG elements so as to divide the bar-shaped member into a plurality of the magnetic head element sections. A lead layer of each ELG element is connected to the nearest inner lead layer of the adjacent magnetic head element section, and a connecting pad is connected to a pad for monitoring the ELG element. Terminal pillars in the lead layers act as a common terminal pillar of the magnetic head element section and the ELG element.

Method of manufacturing magnetic head elements

According to a method of manufacturing a magnetic head, a magnetoresistive device is formed on a substrate, a top end portion of the magnetoresistive device is placed in an external magnetic field, and a height of the magnetic head is adjusted by ceasing a polishing operation at an instant when change in resistance of the magnetoresistive device relative to change in the external magnetic field comes up to a predetermined value.

Magnetoresistive type magnetic head and method of manufacturing the same and apparatus for polishing the same

The present invention relates to an automatic lapping method and a lapping apparatus for lapping a work piece, which is bonded to a row bar, including a thin-film element in order to control the lapping process by accurately measuring height of the work piece. The automatic lapping apparatus may include a lapping plate for lapping a thin-film, which is bonded to a row bar, including a monitoring element having at least an analog resistance value which is analogously varied according to lapping; and a controller for converting the analog resistance value to height of said thin-film element and controlling said lapping plate to stop the lapping process when the height of the thin-film element has reached to a targeted value, wherein said controller employs a previously measured resistance value as a currently measured resistance value when the currently measured resistance value is less than the previously measured resistance value.

Automatic lapping method of a thin film element and a lapping apparatus

In a method for fabricating a magnetic head in which a block is cut from a wafer, and either the element height of a magnetoresistive head or the gap depth of a thin-film magnetic head is machined to a prescribed value, a resistance monitoring pattern for monitoring element height machining, said monitoring pattern comprising a first resistance pattern having a surface area which decreases in a nearly linear manner as machining progresses in the direction that reduces the element height and a second resistance pattern having a surface area which decreases in nearly piecewise linear manner as machining progresses in the direction that reduces the element height, is formed on the wafer block at the time of said wafer process, a determination being made during the machining and based on the resistance value of the resistance monitoring pattern, of the timing of stopping the machining which reduces the element height.

Method for fabricating magnetic head

A lapping apparatus for uniformly laps work pieces. The lapping apparatus includes a rotary lapping plate, a lapping base including a plurality of pads contacting the lapping plate, an adapter including first and second surfaces for supporting the mounting base contacting the lapping plate, and a supporting mechanism provided on the lapping base for supporting the second surface of the adapter by a supporting point. As the adapter supporting the work piece is supported on two points on the work piece and one supporting point of the lapping plate, the lapping surface of the work piece may follow as the lapping plate. Accordingly, it becomes possible to uniformly lap the work piece regardless of accuracy of the lapping base.

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Kawasaki, Japan

Motoichi Watanuki