Sanyo Electric Co., Ltd.

Motoichi Nezu

Sadamichi Takakusaki

Yusuke Igarashi

Takaya Kusabe

Masahiko Mizutani

Kazutoshi Motegi

Noriaki Sakamoto

Mitsuru Noguchi

In a hybrid integrated circuit device that is a circuit device of the present invention, a conductive pattern including pads is formed on a surface of a substrate. A first pad is formed to be relatively large since a heat sink is mounted thereon. A second pad is a small pad to which a chip component or a small signal transistor is fixed. In the present invention, a plated film made of nickel is formed on a surface of the first pad. Therefore, the first pad and a solder never come into contact with each other. Thus, a Cu/Sn alloy layer having poor soldering properties is not generated but a Ni/Sn alloy layer having excellent soldering properties is generated. Consequently, occurrence of sink in the melted solder is suppressed.

Circuit device and method of manufacturing the same

Provided are a hybrid integrated circuit device in which fine patterns can be formed while current-carrying capacitances are ensured, and a method of manufacturing the same. The hybrid integrated circuit device of the present invention includes conductive patterns formed on a front surface of a circuit substrate and circuit elements electrically connected respectively to the conductive patterns. The conductive patterns include a first conductive pattern and a second conductive pattern formed more thickly than the first conductive pattern. The second conductive pattern includes a protruding portion protruding in a thickness direction thereof.

In preferred embodiments, a method of manufacturing a hybrid integrated circuit device is provided, in which a plurality of circuit substratesare manufactured from a single metal substrateA' by dicing. In some embodiments, the method includes: preparing a metal substrateA&#x2032; having an insulating layerformed on the top surface thereof; forming a plurality of conductive patternson the top surface of insulating layer; forming groovesin lattice form on the rear surface of metal substrateB&#x2032;; mounting hybrid integrated circuits onto conductive patterns; and separating individual circuit substrateswith, for example, a rotatable cutter.

Methods for manufacturing a hybrid integrated circuit device

To provide a method of manufacturing a highly reliable circuit device realizing a smaller, thinner and lighter configuration. In the method of manufacturing a circuit device according to the invention, a resin sealed body is separated from a supporting substrate, after the resin sealed body containing a circuit device is formed on a top surface of the supporting substrate. Therefore, manufacture of a circuit device having no substrate becomes possible and it realizes a thinner and lighter circuit device with improved heat dissipation. Moreover, since sealing with a sealing resin can be performed on the supporting substrate, warps, caused by the differences in thermal expansion coefficients between the sealing resin and conductive patterns and between the sealing resin and circuit components, can be prevented. Hence, it becomes possible to prevent flaking of conductive patterns from the substrate and a poor contact between the conductive patterns and a metal thin wire, and consequently to manufacture a highly reliable circuit device.

Method of manufacturing circuit device

In preferred embodiments, a compact a hybrid integrated circuit devicecan be provided. A conductive patternis formed on the top surface of a circuit substrate, on the top surface of which an insulating layerhas been provided. Conductive patternis formed over the entirety of the top surface of the circuit substrate. Specifically, conductive patternis also formed at parts withinmm from the peripheral ends of circuit substrate. Also, a heat sinkA or other circuit elementwith some height can be positioned near a peripheral end part of circuit substrate. By arranging hybrid integrated circuit device, the degree of integration of hybrid integrated circuit is improved. Thus, in a case where the same circuit as a prior-art example is formed, the size of the entire hybrid integrated circuit device can be made small.

Growing community of inventors

Ora-gun, Japan

Motoichi Nezu