Murata Manufacturing Co., Ltd.

Motoi Nishii

Yoshihiro Nishinaga

Hiroyuki Takeuchi

Katsuhisa Imada

Naotaka Oiwa

Eiichi Maeda

Takashi Kobayashi

Yoshiyuki Hatsuda

Masaharu Ikeda

Yukio Sakamoto

Katsuyuki Uchida

Masami Sugitani

Toshio Kawabata

Kaoru Tachibana

Takehiko Otsuki

A ceramic electronic component includes a ceramic sintered compact containing about 35 to 80 volume percent pores and an electrode provided inside the ceramic sintered compact. The pores are filled with resin or glass. This ceramic electronic component is formed by forming a green compact which includes an electrode therein with a ceramic compound having a ceramic raw material, a binder and a spherical or granular combustible material having adhesiveness to the binder. The green compact is fired to form the ceramic sintered compact including the electrode and containing about 35 to 80 volume percent pores. The pores of the ceramic sintered compact are filled with resin or glass.

Ceramic electronic component and method for making the same

A method for producing a multi-layered chip inductor includes the steps of: forming coil-shaped internal conductors inside a green ceramic laminate, each of which coil-shaped internal conductors is spiralled around an axial line in the laminating direction of the green ceramic laminate; applying an external electrode paste onto at least one laminating-direction surface of the green ceramic laminate, which external electrode paste connects to an end of the coil-shaped internal conductor; cutting the green ceramic laminate along the laminating direction into chip-shaped-green ceramic laminates each having the coil-shaped internal conductor inside; and firing each of the chip-shaped green ceramic laminates and baking the external electrode paste to form an external electrode.

Method for producing multi-layered chip inductor

A method is provided for manufacturing a multilayer-type chip inductor having a small DC resistance without decreasing the inductance or the impedance. The method of manufacturing a multilayer-type chip inductor includes the steps of: preparing a ceramic green sheet; forming an electrode film on one surface of the green sheet; multilayering a plurality of the green sheets in such a way that the surfaces on which electrode films are formed face each other for pairs of the green sheets; contact-bonding the green sheets; and sintering the green sheets.

Method of manufacturing multilayer-type chip inductors

In a laminated inductor array, four spiral inductors are aligned from the left end surface to the right end surface of a laminated body. In the direction of alignment of the spiral inductors, the number of the coil conductors on the side portion of the left end surface of the inductor located close to the left end portion of the laminated body and the number of the coil conductors on the side portion of the right end surface of the inductor located close to the right end portion of the laminated body are the same.

Laminated inductor array

When a plurality of devices are disposed in parallel in a magnetic ceramic laminated member to form a complex electronic component, an insulating member is disposed between adjacent devices. When adjacent devices among a plurality of devices are disposed on different planes in a magnetic ceramic laminated member to form a complex electronic component, an insulating member is disposed at least at a part of an intermediate layer positioned between the adjacent devices in the lamination direction.

Complex electronic component

A multi-layered inductor array is constructed to reduce and minimize variations in the inductance values and DC resistance values of a plurality of inductors contained in a multi-layered structure. In this multi-layered inductor array, four spiral inductors having an equal number of winding turns are aligned from the left end surface of the multi-layered structure to the right end surface thereof. In the direction in which the four spiral inductors are aligned, the lengths of the spiral portions of the inductors positioned at the central portion of the multi-layered structure are greater than those of the spiral portions of the spiral inductors positioned at both end portions thereof.

Multi-layered inductor array

Complex electronic component having a plurality of devices formed side by side in a ceramic material

A method for producing a multi-layered chip inductor includes the steps of: forming coil-shaped internal conductors inside a green ceramic laminate, each of which coil-shaped internal conductors is spiralled around an axial line in the laminating direction of the green ceramic laminate; applying an external electrode paste onto at least one laminating-direction surface of the green ceramic laminate, which external electrode paste connects to an end of the coil-shaped internal conductor; cutting the green ceramic laminate along the laminating direction into chip-shaped green ceramic laminates each having the coil-shaped internal conductor inside; and firing each of the chip-shaped green ceramic laminates and baking the external electrode paste to form an external electrode.

An insulating ceramic composition which comprises about 62-75 wt % of silicon oxide (in terms of SiO.sub.2), about 4-22 wt % of barium oxide (in terms of BaCO.sub.3), about 0.5-2.5 wt % of aluminum oxide (in terms Al.sub.2 O.sub.3), 0 to about 0.8 wt % of chromium oxide (in terms of Cr.sub.2 O.sub.3), about 0.2-0.8 wt % of calcium oxide (in terms of CaCO.sub.3), about 8-18 wt % of boron oxide (in terms of B.sub.2 O.sub.3), and 0 to about 2.5 wt % of potassium oxide (in terms of K.sub.2 O). A ceramic inductor is made of said insulating ceramic composition.

Insulating ceramic composition and ceramic inductor using the same

A composite component includes a main body which is constituted by combining a first block which is made of dielectric material and contains capacitor electrodes, with a second block which is made of magnetic material and contains inductor electrodes. The main body is provided with recesses for receiving other components and connection electrodes to which the other components are connected. The connection electrodes are themselves connected to lead-out electrodes. The main body is further provided with external electrodes for connection to the capacitor electrodes, the inductor electrodes and the lead-out electrodes.

Composite component

A composite electronic component includes a sintered body, an inductor part and a capacitor part which are formed in the sintered body, and a ground electrode which is formed on an outer surface of the sintered body to be electrically connected to a first capacitor electrode of the capacitor part and not to reach an outer surface of the inductor part on the outer surface of the sintered body.

Composite LC device with a ground electrode not formed on the inductor

A semiconductor ceramic composition of a barium titanate system comprises a main component containing a minor quantity of one or more semiconductor-forming elements, and additives of manganese oxides and silica incorporated therein, and is characterized by that the main component consists essentially of 30 to 95 mol % of BaTiO.sub.3, 3 to 25 mol % of CaTiO.sub.3, 1 to 30 mol % of SrTiO.sub.3 and 1 to 50 mol % of PbTiO.sub.3. The contents of manganese oxides and silica are 0.03 to 0.15 mol %, preferably, 0.03 to 0.10 mol % in terms of Mn, and 0.5 to 5 mol % in terms of SiO.sub.2, respectively, with respect to one mole of the main component. One or more semiconductor-forming elements are selected from the group consisting of rare earth elements, Nb, Bi, Sb, W and Th, and the content of the elements is 0.2 to 1.0 mol %.

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Omihachiman, Japan

Motoi Nishii