Sekisui Chemical Co., Ltd.

Motohiro Yagi

Koichi Shibayama

Hidenobu Deguchi

Koji Yonezawa

Akihiko Fujiwara

Hideaki Ishizawa

Munehiro Hatai

Nobuhiro Goto

Kazuyoshi Shiomi

Kazunori Akaho

Masakazu Nakata

A thermosetting resin composition capable of providing a molding, such as a resin sheet, that excels in not only dielectric characteristics but also dimensional stability at high temperature and even after exposure to high temperature thermal history, exhibits little dimensional change by the thermal history, namely, exhibiting low linear expansion coefficient. There are further provided a resin sheet and resin sheet for insulated substrate produced from the thermosetting resin composition. In particular, there is provided a thermosetting resin composition comprising an epoxy resin of 100 to 2000 epoxy equivalent, an epoxy resin hardening agent consisting of a phenolated compound, and a layered silicate, and are further provided a resin sheet comprised of the thermosetting resin composition and a resin sheet for insulated substrate comprised of the resin sheet.

Thermosetting resin composition, resin sheet and resin sheet for insulated substrate

A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. The resin composition containing 100 parts by weight of a thermosetting resin and 0.1-65 parts by weight of a layered silicate inorganic compound, the resin composition having a mean linear expansion coefficient (&#x3b1;2) of up to 17&#xd7;10[&#xb0; C.] over the temperature range from a temperature 10&#xb0; C. higher than a glass transition temperature of the resin composition to a temperature 50&#xb0; C. higher than the glass transition temperature of the resin composition.

Resin composition of layered silicate

Photocurable pressure-sensitive adhesive composition and its sheet

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Osaka, Japan

Motohiro Yagi