Hitachi Chemical Company, Ltd.

Motohiro Arifuku

Itsuo Watanabe

Tohru Fujinawa

Kouji Kobayashi

Houko Kanazawa

Atsushi Kuwano

Yasushi Gotoh

Kouji Motomura

Kazuyoshi Kojima

Yasushi Gotou

Takashi Nakazawa

Takashi Tatsuzawa

Atushi Kuwano

Nichiomi Mochizuki

Masami Yusa

Satoyuki Nomura

Hiroshi Ono

Hoko Kanazawa

Isao Tsukagoshi

Hiroshi Yasuda

The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.

Circuit connection material, circuit member connecting structure and method of connecting circuit member

The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 &#x3bc;m or greater but less than 10 &#x3bc;m and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40&#xb0; C. and a mean coefficient of thermal expansion of 30 to 200 ppm/&#xb0; C. at from 25&#xb0; C. to 100&#xb0; C. when subjected to the curing treatment.

Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same

A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Circuit-connecting material and circuit terminal connected structure and connecting method

The invention provides a circuit connecting method that can satisfactorily reduce connection resistance between circuit electrodes electrically connected via an anisotropic conductive film for circuit connection. The circuit connecting method comprises a step of preparing a circuit memberhaving circuit electrodesformed on a glass substrate, a step of preparing a flexible wiring boardhaving circuit electrodesformed on a baseand provided with a solder resistat the sections of the circuit electrodesother than the sections that are connected to the circuit electrodes, and a step of bonding the circuit memberto the flexible wiring boardvia an anisotropic conductive film for circuit connectionso that part of the anisotropic conductive film for circuit connectionoverlaps with part of the solder resist. The thickness hof the anisotropic conductive film for circuit connectionis no greater than the total of the height hof the circuit electrodesand the height hof the circuit electrodes

Circuit connecting method

A wiring structure having a wiring-terminal-connection adhesive that includes a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles.

Wiring terminal-connecting adhesive

This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

Adhesive, method of connecting wiring terminals and wiring structure

Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same

A circuit-connecting material interposed between mutually-facing circuit electrodes, and electrically connecting the electrodes, either by direct contact, or via conductive particles present in the material. The circuit-connecting material features: (1) a curing agent capable of generating free radicals upon heating; (2) a radical-polymerizable substance, and two or more microscopically separated phases. The two or more microscopically separated phases include an elastomer phase of carboxyl-group-containing elastomer and a phenoxy resin phase of a phenoxy resin having a weight average molecular weight of 10,000 or more.

A circuit-connecting material for interposing between circuit electrodes facing each other and electrically connecting the electrodes, after curing by heat and pressure, either by direct contact or via conductive particles present in the material. The circuit-connecting material features the following essential components: (1) a curing agent capable of generating free radicals upon heating, (2) a phenoxy resin having a weight average molecular weight of 10,000 or more, and that is chemically modified by a carboxyl-group-containing elastomer, and (3) a radical-polymerizable substance.

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Ibaraki, Japan

Motohiro Arifuku