Sony Chemicals Corporation

Sony Chemical & Information Device Corporation

Motohide Takeichi

Junji Shinozaki

Yukio Yamada

Hidekazu Yagi

Norikazu Iwasaki

Hiroyuki Fujihira

Yasuhiro Suga

Masao Saito

Yasushi Akutsu

Yuji Furuuchi

Misao Konishi

Hisaya Tamura

Kaori Suemasa

A chip-on-glass (COG) assembly, in which the electrodes of the semiconductor chips () are held in direct connection with the corresponding electrodes on the substrate glass circuit board (), utilizes a layer () of a connecting material for bonding and connecting the semiconductor chip () with the substrate board (). The connecting material can provide a reduced stress concentration at the boundaries between the binder layer () and the chip () and between the binder layer () and the glass board (), even at higher adhesive strengths, bringing about less deformation, such as warping, of the resulting bonded assembly, even when using a thinner substrate glass board, and provides a superior bonding strength and excellent electroconductive performance. The connecting material is made up of, on the one hand, an adhesive component () containing a thermosetting resin and, on the other hand, electroconductive particles () and has a characteristic feature that a tensile elongation percentage at 25&#xb0; C., after having been cured, is at least 5%.

COG-assembly and connecting material to be used therein

Thermosetting adhesive material

An adhesive for semiconductor chips contains a first resin component which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component and a second hardener which is addition-polymerized with the first resin component. When the adhesive is applied on a wiring board and a semiconductor chip is applied thereon and heat is applied, the second hardener is addition-polymerized with the backbone of the three-dimensional network formed by the self-polymerization reaction of the first resin component. The first temperature at which the addition polymerization zone becomes a rubbery structure is lower than the second temperature at which the backbone becomes a rubbery structure, so that the elastic modulus loss sharply increases at the first temperature to reduce the stress between the semiconductor chip and the wiring board.

Adhesives and electric devices

Adhesive material and circuit connection method

The present invention is a connection material which enables a flexible circuit board to be connected to a bare IC chip without causing a shoulder touch effect. The connection material contains an insulating adhesive and a flaky or fibrous insulating filler dispersed therein is used for connecting a film-like flexible circuit board and a bare IC chip. The aspect ratio of the flaky or fibrous insulating filler is no less than 20.

Connection material

A connecting material for bonding and connecting elements each having electrodes thereon in a correspondingly confronting relation to each other, while attaining electroconductive connection between the corresponding electrodes, which material has a high heat resistance and can avoid occurrence of faulty electrical conductance even in the case of bonding elements having a large number of electrodes arranged, thus, at a considerably small interval under such a condition that the bonded assembly is exposed to a service environment of high temperature or of high temeperature and high humidity, wherein the connecting material contains a thermosetting resin and an inorganic filler and has, after having been cured, characteristic features of a modulus of elasticity of 1-12 GPa, a glass transition temperature Tg of 120-200&deg; C., a coefficient of linear expansion (&agr;1) of 50 ppm/&deg; C. or less at temperatures below the Tg and a coefficient of linear expansion (&agr;2) of 110 ppm/&deg; C. or less at temperatures above the Tg, wherein the difference (&agr;2&minus;&agr;1) does not exceed over 60 ppm/&deg; C.

Connecting material

A method for mounting electronic elements, comprises the step of arranging a thermosetting adhesive between a circuit board, situated on a stage, and an electronic element to be connected with the wiring pattern of the circuit board, and then bonding the electronic element to the circuit board by the application of heat and pressure from the electronic element side. The electronic element is temporarily thermocompression-bonded to the circuit board such that the thermosetting reaction rate of the thermosetting adhesive on the side of the circuit board is lower than the thermosetting reaction rate on the side of the electronic element. The thermosetting adhesive is then set finally in order to bond the electronic element to the circuit board.

Method for mounting electronic elements

A connecting material for bonding and connecting elements to be bonded together, each element having electrodes thereon in a correspondingly confronting relationship to each other. The material is highly reliable in the strength of bonding of the elements and in building up electroconductive connection between the corresponding electrodes and can provide mechanical bonding and electrical connection effectively even when bonding an element of a polyimide resin film with a counter element, without the occurrence of a reduction in the reliability of the electrical conductance, even in services under a high temperature and high humidity. The connecting material contains an adhesive component containing a thermosetting resin and has, after having been cured, characteristic features of a modulus of elasticity at 30&deg; C. in the range of 0.9-3 Gpa, a glass transition temperature of at the lowest 100&deg; C. and a tensile elongation percentage of at least 3%.

Connecting material and connection structure

A connecting material for anisotropically electroconductive connection for bonding and connecting a semiconductor element having a plurality of electrodes recessed from the outer face of the passivation layer formed on the semiconductor element, on the one hand, with a substrate circuit board having a plurality of electrodes in a correspondingly confronted relation to the electrodes of the semiconductor element, on the other hand, which connecting material can afford to attain simultaneously a reliable mechanical bonding of the element with the circuit board and a secured electroconductive connection between the correspondingly confronted electrodes without suffering from damage of the passivation layer, even if the passivation layer is made of a resin. The connecting material ( ) is made up of an adhesive component ( ) of insulating property and electroconductive particles ( ), wherein each of the electroconductive particles ( ) is formed of a resin core particle ( ) coated with a metal layer ( ) and the average particle size d of the electroconductive particles ( ) is at least 1.5 times the recessed depth h of the electrodes ( ) from the outer face of the passivation layer ( ) of the semiconductor element ( ) and at most 0.5 time the distance s between the neighboring electrodes ( ).

Connecting material for anisotropically electroconductive connection

Anisotropically electroconductive adhesive material and connecting method

Substrate warpage is eliminated without adversely affecting connection reliability when an IC chip or other packaging component is mounted on a substrate by thermocompression bonding with an interposed thermosetting adhesive. In a packaging method for the thermocompression bonding of a substrate and an IC chip or other packaging component between a stage and a head by means of an interposed thermosetting adhesive, the temperature of the stage during thermocompression bonding is set above the temperature corresponding to the inflection point of the elastic modulus in the relationship between the elastic modulus and the temperature of the cured adhesive.

Packaging method

A multilayer anisotropic electroconductive adhesive, comprises an anisotropic electroconductive adhesive layer and laminated to at least one side thereof an insulating adhesive layer. The anisotropic electroconductive adhesive layer comprises a film-forming resin and electroconductive particles and has a melt viscosity at 150.degree. C. of 100 poise or higher, and the insulating adhesive layer comprises a latent curing agent and a resin having a functional group and has a melt viscosity at 150.degree. C. of less than 100 poise.

Multilayer anisotropic electroconductive adhesive and method for

An anisotropically electroconductive adhesive to be used for establishing electric connection between terminals of, for example, an IC chip and of a circuit pattern, at a low cost with high reliabilities both in the establishment of electric connection and in the insulation upon the connection without suffering from short-circuiting between circuit lines in the circuit and without causing any obstruction on the circuit, even when the terminals or the circuit lines are disposed at close intervals, which adhesive comprises an electrically insulating adhesive matrix and electroconductive particles dispersed in the matrix, wherein the electroconductive particles comprise at least two electroconductive particulate products of different average particle sizes and wherein each particle of both the particulate products is coated with an electrically insulating resin insoluble in the insulating adhesive matrix.

Anisotropically electroconductive adhesive and adhesive film

A battery having a protecting element which has a simple structure and is easy to be miniaturized to permit installation within the battery cell without altering the structure and the production plan of the battery cell to a considerable extent and which has a function of melting down reliably upon detection of an abnormal state of the temperature or current of the battery. The protecting element 1 is formed from a base board 5 which is composed of an insulator layer 2 interposed between a first and a second conductor layer 3 and 4 and is provided with a through-hole 6 so as to bring about electrical conduction between the first and second conductor layers, wherein one of the conductor layers (3) is subdivided into a plurality of independent conductor layer patches (3a and 3b) separated by a vacant space 7 and the so-separated patches (3a and 3b) are bridged with a low-melting metal layer 8 to provide electrical conduction therebetween to build up a fuse unit 11 sealed by a protection member 10 and a safety valve 15 is formed in the through-hole 6 by covering the through-hole 6 with a lamellar closure member 13, wherein the protecting element 1 is installed in the battery cell integrally with the cathode terminal 16 via a PTC element.

Growing community of inventors

Kanuma, Japan

Motohide Takeichi