Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Motoaki Satou

Toshiyuki Fukuda

Takeshi Kawabata

Seiichi Nakatani

Kazuhiro Nobori

Toshio Tsuda

Masatoshi Shinagawa

Tadahisa Inui

A semiconductor module is formed by alternately stacking resin boards and sheet members. Each of the resin boards includes first buried conductors. A semiconductor chip is mounted on the upper face of each of the resin boards. Each of the sheet members having an opening for accommodating the semiconductor chip and including second buried conductors electrically connected to the first buried conductors. A first resin board located at the bottom is thicker than second resin boards. Each of the sheet members includes an adhesive member covering the upper and side faces of the semiconductor chip.

Multilevel semiconductor module and method for fabricating the same

An imaging module is formed by stacking: a first resin board; a second resin board having a first opening; a first electrically-conductive member electrically connecting the first resin board and the second resin board to each other; a printed circuit board having a second opening; a second electrically-conductive member electrically connecting the second resin board and the printed circuit board to each other; an imaging semiconductor chip mounted on the lower surface of the second resin board to cover the first opening and provided with an imaging sensor, an optical member placed on the upper surface of the second resin board to cover the first opening; a first semiconductor control chip provided with a control device for controlling operation of the imaging sensor and mounted on the lower surface of the first resin board.

Imaging module and method for forming the same

A semiconductor module is formed by alternately stacking resin boardson which semiconductor chipsare mounted and sheet members having openings larger than the semiconductor chipsand bonded to the resin boards. The resin boardlocated at the bottom out of the resin boardsis thicker than the other resin boards

Multi-level semiconductor module and method for fabricating the same

A semiconductor module is formed by alternately stacking resin boards on which semiconductor chips are mounted and sheet members having openings larger than the semiconductor chips and bonded to the resin boards. One of the resin boards located at the bottom has a thickness larger than that of each of the other resin boards. First buried conductors formed in each of first resin boards are arranged to form a plurality of lines surrounding a region on which a semiconductor chip is to be mounted. The spacing between the first buried conductors increases in succession toward the outermost line. Second buried conductors formed in each of sheet members are arranged to form a plurality of lines surrounding an opening. The spacing between the second buried conductors increases in succession toward the outermost line.

Multi-level semiconductor module

A lead frame is provided. Although there is a die pad () located to deviate from a main plane center line of a resin molding area (), a die pad connecting portion () is located to deviate from the main plane center line of the resin molding area in a direction opposite to the deviation direction of the deviated die pad (), so that it is possible to reduce a Z-directional vertical variation of the die pad in processes. Accordingly, it is possible to prevent resin molding defects such as package bending, voids, failure of resin filling, wire disconnection, exposure of semiconductor chips, and exposure of die pads.

Growing community of inventors

Kyoto, Japan

Motoaki Satou