Exascaler Inc.

Terarecon, Inc.

Pezy Computing K.k.

Ultramemory Inc.

Motoaki Saito

Kazuo Takahashi

Tiecheng T Zhao

Vikram Simha

Robert James Taylor

Akio Iwase

Sunao Torii

Takao Adachi

Keiji Ito

Kimiaki Saito

A processor module includes a first circuit substrate and a second circuit substrate each having a processor mounting area and a memory mounting area on one surface thereof. One processor is mounted in the processor mounting area, while comb-like arranged memory modules are mounted in the memory mounting area. The surface of the first circuit substrate and the surface of the second circuit substrate are combined face-to-face and positioned such that the processor mounting area and the memory mounting area of the first circuit substrate are placed face-to-face respectively with the processor mounting area and the memory mounting area of the second circuit substrate, and end parts of the plurality of comb-like arranged memory modules of the first circuit substrate and end parts of the plurality of comb-like arranged memory modules of the second circuit substrate are alternately arranged with clearances produced between adjacent memory modules.

Liquid immersion-cooled electronic device and liquid immersion-cooled processor module

Provided is a cooling system capable of effectively avoiding generation of bubbles in the flow passage including the piping unit that climbs over the barrier upon start of the pump that has been in the stopped state. The cooling systemincludes a cooling tankfilled with a coolant C, flow passagesthrough which the coolant discharged from an outlet of the cooling tankreturns to an inlet of the cooling tank, an inverted U-like piping unitdisposed in the middle of the flow passage, a main pump, an auxiliary pumpdisposed opposite the main pumpwhile interposing the inverted U-like piping unitwith the main pump, and a controllerwhich controls driving operations of the main pumpand the auxiliary pump. The controllerdrives the auxiliary pumpfor a predetermined time period before starting the main pump. The predetermined time period for driving the auxiliary pumpmay be arbitrarily set so long as the preliminary flow of the coolant C is generated. As the auxiliary pumpmay be driven for only a short time period, silence in the room is hardly deteriorated even in the case that the pump is disposed inside the building.

Cooling system to minimize generation of bubbles inside flow passage by utilizing an auxiliary pump

An electronic device is immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in a housing part of the cooling apparatus, and includes a base board, storage substrates to be arranged on at least one surface of the base board, a backplane mounted orthogonally onto the one surface of the base board, and flash storage units mounted on the respective storage substrates. The backplane includes a combination of backplane units each including a signal connector and a power connector. The signal connector and the power connector are disposed separately for each of the backplane units. The flash storage units are arranged on a surface parallel to at least one surface of each of the storage substrates so as to be adjacent one another in a width or a length direction of the flash storage unit.

Electronic device for liquid immersion cooling

Provided is a power supply unit which is immersed and directly cooled in a coolant filled in a cooling apparatus. The power supply unit includes a unit substrate, and a voltage step-down device mounted on the unit substrate. The unit substrate includes a voltage input terminal for supplying an external power supply voltage, and a voltage output terminal. The voltage output terminal is electrically connected to a voltage input terminal of an electronic device. The power supply unit is mounted on a bottom of a cooling tank of the cooling apparatus so that the electronic device is positioned at an upper part of the power supply unit upon electrical connection between the electronic device and the power supply unit, and cooled by the coolant flowing from the bottom, or flowing from another section of the cooling tank. The unit substrate may be disposed apart from the bottom so as to form a flow channel which allows passage of the coolant between one surface of the unit substrate and the bottom. The voltage step-down device may be configured to include a converter module which steps down the external high voltage DC voltage from 200V to 420V to the DC voltage from 24V to 52V.

Electronic device for liquid immersion cooling, power supply unit, and cooling system

A set of the dies and the package are provided with a plurality of dies each including at least an accelerator core or a CPU core, an external interface, memory interfaces, and a die interface for connecting to another die. At least two dies of the set of dies include a first type die and a second type die each including both the accelerator core and the CPU core, and the core number ratio between the accelerator core and the CPU core in the first type die differs from that in the second type die. The memory interfaces include an interface conforming to TCI. The memory interfaces further include an interface conforming to HBM.

Die and package

Provided are an electronic device and a power supply unit, both of which are immersed and directly cooled in a coolant filled in a cooling apparatus. The electronic device includes a carrier substrate having a voltage input terminal for supplying a DC voltage for the electronic device, a plurality of module connectors arranged on one surface of the carrier substrate, a plurality of module substrates, a plurality of supporting plates for holding both ends of the respective module substrates, and a supporting member for supporting the carrier substrate. The voltage input terminal is electrically connected to a voltage output terminal of the power supply unit. Each of the module substrates includes a module connector plug electrically coupled to each of the module connectors. The supporting member supports the carrier substrate so as to be positioned at the upper part of the power supply unit mounted on the bottom of the cooling tank of the cooling apparatus upon electrical connection between the electronic device and the power supply unit. The power supply unit includes a unit substrate, a voltage step-down device mounted on the unit substrate, and a stage to which the unit substrate is fixed.

Provided efficiently and at low cost are: a package for core number ratios appropriate for all types of computers; and dies included in the package. This package includes at least one die provided with: at least one of a first core formed of a CPU core or a latency core and a second core formed of an accelerator core or a throughput core; an external interface; memory interfacesto; and a die interfacewhich is connected to another die. The die includes a first type die and a second type die each including both the first core and the second core and the core number ratio between the first core and the second core in the first type die differs from that in the second type die. Moreover, the memory interfaces include an interface conforming to TCI. In addition, the memory interfaces further include an interface conforming to HBM.

An electronic device, immersed in a coolant filled in a cooling apparatus, and directly cooled, is configured to be housed in a housing part of the cooling apparatus, and includes a pair of substrate groups that includes a first circuit board having at least one processor and main memories mounted onto one surface of the board, coprocessors, each having a housing with a rectangular cross-section, and an electric connection terminal, and a connector for electric connection between the first circuit board and the coprocessors. When each of the electric connection terminals of the coprocessors is inserted into the connector, a distance between the one surface of the first circuit board and a housing bottom surface of each of the coprocessors is longer than a height of the processor and each height of the main memories. The pair of substrate groups is combined while having the first circuit boards arranged at a rear surface side in a direction for reducing a distance between the one surface of the first circuit board of one of the substrate groups and a housing upper surface of each of the coprocessors of the other of the substrate groups.

An electronic device is immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in each of housing parts of the cooling apparatus, and includes a metal board held with a pair of board retainers disposed in the housing part, one or more substrate groups attached to a first surface of the metal board and a second surface opposite the first surface, and a plurality of slots disposed above the one or more substrate groups, and arranged onto the metal board in parallel, each of which allows a power unit to be housed. The third circuit board is disposed so that the slots are interposed between the third circuit board and the metal board, and the network cable sockets are arranged in parallel on one side of the third circuit board, located at an opening side of the slots.

Electronic device for liquid immersion cooling and cooling system using the same

A signal bridge device is provided with a plurality of bridge signal transmission/reception units, a plurality of bridge signal transmission/reception terminals, and a bridge signal distribution unit. Non-contact reception signals received by the bridge signal transmission/reception units are input into the bridge signal distribution unit. Contact reception signals received by the bridge signal transmission/reception terminals are input into the bridge signal distribution unit. The bridge signal distribution unit can output the non-contact reception signals to the bridge signal transmission/reception terminals and can output the contact reception signals to the bridge signal transmission/reception units.

Signal bridge device

A cooling system is configured to directly cool electronic devices of different types immersed in a coolant filled in a cooling apparatus having a cooling tank with an open space defined by a bottom wall and side walls, arranged housing parts formed by dividing the open space using internal partition walls in the cooling tank, an inflow opening formed in a bottom part or a side surface of each of the housing parts, and an outflow opening formed around a surface of the coolant circulating in the respective housing parts. Electronic devices of different types include first electronic devices configured to execute arithmetic operations through processors, and second electronic devices configured to execute storage through storage units. The arbitrary numbers of the first and second electronic devices are separately housed in the housing parts of the cooling apparatus to form a computer with a calculation capacity and a storage capacity.

An electronic device is immersed in a coolant in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in housing parts of the cooling apparatus, and includes a metal board held with a pair of board retainers disposed in the housing part, storage units attached to a first surface of the metal board and a second surface opposite the first surface, and a backplane including connectors for electrically connecting the respective storage units, attached orthogonally to the first surface of the metal board, and the second surface opposite the first surface. The metal board includes a primary member including cuts in a width direction for fixing support plates that support the storage units to the primary member, and a secondary member includes pawls inserted into slits in the backplane, and fixed to the primary member. The support plates include holes for passage of the coolant.

Inner partitions disposed within a cooling tank have an open space to form arrayed housing parts, and at least one unit of electronic device housed in each of the housing parts. A lifting mechanism includes a tower having a guide and a driving source for raising and lowering an arm, a slide mechanism attached to the cooling tank, and a stopper for restricting the tower's movement so that a range of the tower's motion in a width direction of the cooling tank does not exceed at least a width of the open space. The slide mechanism supports the tower movably with respect to the cooling tank in a horizontal plane located above the open space. The liquid immersion cooling system can safely lift or lower the electronic devices densely housed within the cooling tank without requiring the stage in the periphery of the installation surface of the cooling tank.

Liquid immersion cooling system

A semiconductor device includes a first semiconductor chip and a second semiconductor chip The first semiconductor chip includes a transmission circuit input unit, a transmission circuit unit, and a transmission unit. The second semiconductor chip includes a reception unit, a reception circuit unit, and a reception circuit output unit. The transmission unit and the reception unit can communicate with each other in a non-contact manner. A transmission circuit unit input signal having a predetermined transmission-side potential is input into the transmission circuit unit. A reception circuit unit input signal is input into the reception circuit unit via the non-contact communication between the transmission unit and the reception unit. The reception circuit unit outputs a reception circuit unit output signal having a predetermined reception-side potential. The ratio of the reception-side potential to the transmission-side potential can be changed.

Semiconductor device

An electronic device, immersed in a coolant filled in a cooling apparatus, and directly cooled, is configured to be housed in housing parts of the cooling apparatus, and includes a metal board held with board retainers disposed in the housing part, and substrate groups attached to a first surface of the metal board and a second surface opposite the first surface. The substrate group includes first circuit boards, each including sockets for mounting processors and main memories on one surface of a substrate, and a component for interconnecting the processors, a second circuit board including a mother board component which includes a chipset for controlling the main memory, and a flow channel formed in a gap between a surface opposite the one surface of the first circuit boards, and one surface of the second circuit board, which faces the surface opposite the one surface of the first circuit boards.

Growing community of inventors

Tokyo, Japan

Motoaki Saito