Mitsubishi Electric Corporation

Motoaki Nishiwaki

Kenta Fujii

Masaki Seguchi

Kyohei Ishikawa

Nobuaki Tanaka

Hideyuki Masui

A laser processing apparatus includes a laser oscillator; a processing head; a driver that controls a relative positional relationship between a workpiece and the processing head; control circuitry that controls the laser oscillator and the driver in order for the laser beam to scan a processing path on the workpiece; detection circuitry that observes a state of the workpiece being processed and outputs a result of observation as a time series signal; processed state observation circuitry that obtains evaluation information including a determination result that indicates whether a processed state of the workpiece is satisfactory or defective by evaluating the processed state of the workpiece on the basis of the time series signal for each of a plurality of sections obtained by dividing the processing path; and estimation circuitry that estimates a cause of a defect on the basis of the evaluation information of two or more of the sections.

Laser processing apparatus

A machining condition search device according to the disclosure includes a machining condition generation unit, a practical machining command unit, a machining evaluation unit, a prediction unit, an optimum machining condition calculation unit. The machining condition generation unit generates a machining condition defined by one or more control parameters settable on a machining apparatus. The practical machining command unit causes the machining apparatus to perform machining based on a generated machining condition. The machining evaluation unit generates an evaluation value of performed machining, on the basis of information indicating a machining result of the performed machining. The prediction unit predicts an evaluation value corresponding to a machining condition under which machining is not performed, on the basis of the evaluation value and the machining condition corresponding to the evaluation value. The optimum machining condition calculation unit obtains an optimum machining condition on the basis of a prediction value predicted by the prediction unit and an evaluation value generated by the machining evaluation unit. The optimum machining condition is a machining condition under which an evaluation value is equal to or greater than a threshold and a tolerance is maximum.

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Tokyo, Japan

Motoaki Nishiwaki