Lambda Crossing, Ltd.

Power2b, Inc.

Adeia Semiconductor Bonding Technologies Inc.

Technion Research & Development Foundation Ltd

Dsp Group Limited

Lambda Corssing Ltd.

Moti Margalit

Sarah Michelle Lipman

Eran Kali

Boris Gutin

Robert Michael Lipman

Meir Orenstein

Ken Zwiebel

Giles Humpston

Nir Tessler

Jacob Scheuer

Oded Globerman

Belgacem Haba

Roy Shenhar

Eitan Avni

Gideon Rogovsky

Yoav Yadin

Andrey Grinman

Haim Kupershmidt

Avi Neta

Haim Eder

Osher Avsian

Roy Shehhar

Michael Yasin

Eyal Berkowicz

Daphna Bortman-Arbiv

Sarah Lipman

An integrated display and input device including a pixel array operative to provide a visually sensible output, at least one sensor operative to sense at least a position of at least one object with respect to the pixel array when the at least one object has at least a predetermined degree of propinquity to the pixel array and circuitry receiving an output from the at least one sensor and providing a non-imagewise input representing the position of the at least one object relative to the pixel array to utilization circuitry.

Displays and information input devices

An integrated display and input device includes a first pixel array operative to provide a visually sensible output, a second pixel array operative to sense at least a position of an object with respect to the first pixel array, and circuitry receiving an output from the second pixel array and providing a non-imagewise input to utilization circuitry.

A method of charge reuse, the method may include repeating the steps of: electrically coupling a first group of capacitive loads to a second group of capacitive loads; wherein the capacitive loads of the first group and of the second group are Microelectromechanical systems (MEMS) capacitive loads or Nanoelectromechanical systems (NEMS) capacitive loads; charging the second group with a first charge provided from the first group; electrically disconnecting the first group from the second group; operating the second group while using the first charge; electrically coupling the first group to the second group; charging the first group with a second charge provided from the second group; electrically disconnecting the first group from the second group; and operating the first group while using the second charge.

Energy efficient charge reuse in driving capacitive loads

An integrated display and input device including a first pixel array operative to provide a visually sensible output, a second pixel array operative to sense at least a position of an object with respect to the first pixel array and circuitry receiving an output from the second pixel array and providing a non-imagewise input to utilization circuitry.

An interactive assembly including at least one interactive surface element, at least a first region of the at least one interactive surface element having first user sensible functionality and at least a second region of the at least one interactive surface element having second functionality, different from the first user sensible functionality, input sensor functionality, including at least one input sensor located in propinquity to at least one of the at least one interactive surface element, operative to sense impingement of an electromagnetic radiation spot on at least one of the at least one first region and the at least one second region of the at least one interactive surface element and utilization functionality for employing outputs of the input sensor functionality in respect of impingement on either or both of the at least one first region and the at least one second region.

Interactive devices

An electronic device is presented, such as a thin film transistor. The device comprises a patterned electrically-conductive layer associated with an active element of the electronic device. The electrically-conductive layer has a pattern defining an array of spaced-apart electrically conductive regions. This technique allows for increasing an electric current through the device.

Transistor structures and methods of fabrication thereof

A microelectronic unit can include a semiconductor element having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts at the front surface and a rear surface remote from the front surface. The semiconductor element can have through holes extending from the rear surface through the semiconductor element and through the contacts. A dielectric layer can line the through holes. A conductive layer may overlie the dielectric layer within the through holes. The conductive layer can conductively interconnect the contacts with unit contacts.

Semiconductor packaging process using through silicon vias

A stacked microelectronic unit is provided which has a top surface and a bottom surface remote from the top surface and a plurality of vertically stacked microelectronic elements therein, including at least one microelectronic element having a front face adjacent to the top surface and a rear face oriented towards the bottom surface. Each of the microelectronic elements has traces extending from contacts at the front face beyond edges of the microelectronic element. A dielectric layer contacts edges of the microelectronic elements and underlies the rear face of the at least one microelectronic element. Leads are connected to the traces extending along the dielectric layer. Unit contacts, exposed at the top surface, are connected to the leads.

Stack packages using reconstituted wafers

Growing community of inventors

Zichron Yaaqov, Israel

Moti Margalit