Micron Technology Incorporated

Keyssa Systems, Inc.

Qualcomm Incorporated

Intel Corporation

Mostafa Naguib Abdulla

August A Camber

John Rudelic

Steven R Eskildsen

Eric Sweetman

Alan Besel

Ashwin Sethuram

Mohamed Mahmoud

Chang Ki Kwon

Satish Krishnamoorthy

Giriraj Mantrawadi

Jacob Schneider

Young Uk Yim

Bojana Zivanoic

Daoqiang Lu

Roger Dwain Isaac

Jiangqi He

Hari Giduturi

Duane R Mills

Xiang Yin Zeng

Jiamiao Tang

Prince Mathew

Mohammed Mizanur Rahman

Andrew Tohmc

Ming Dong Cui

Gregory V Christensen

The present disclosure relates to extremely high frequency ('EHF') systems and methods for the use thereof, and more particularly to board-to-board connections using contactless connectors.

Board-to-board contactless connectors and methods for the assembly thereof

A hybrid output data path is provided that supports high-voltage signaling and low-voltage signaling. The high-voltage signaling is powered by a high-power supply voltage that is greater than a low-power supply voltage that powers the low-voltage signaling.

High-voltage and low-voltage data paths of a hybrid output driver

A hybrid output driver is disclosed that supports high-voltage signaling and low-voltage signaling. The high-voltage signaling is powered by a high-power supply voltage that is greater than a low-power supply voltage that powers the low-voltage signaling.

High-voltage and low-voltage signaling output driver

In various embodiments, a memory module houses memory devices and, in some embodiments, a memory controller. Each of the devices has a near-field interface coupled to loop antennas to communicate over-the-air data. A coil is formed on, for example, a memory device substrate or molded into a plastic mold to create near-field magnetic coupling between the stacked memory devices and, in certain embodiments, the memory controller. Other embodiments are disclosed.

Wireless serial links for communications between devices formed in a package

A memory device may include an array of closely spaced memory integrated circuits that communicate wirelessly over at least two frequencies using near field coupling.

Wireless communication link using near field coupling

Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.

Signal isolation structures for EM communication

Subject matter disclosed herein relates to memory devices comprising a memory array, a first port to interface with a memory controller directly or indirectly via another memory device, a second port to interface with yet another memory device, and a switch to selectively electrically connect the memory controller to a circuit path leading to the second port or to the memory array, wherein the switch may be responsive to a signal generated by the memory controller.

Multi-device memory serial architecture

A memory device having a memory controller, a main memory with at least a portion comprising persistent memory, and at least two processing entities, wherein the memory controller enables the processing entities to access the main memory according to a cache coherence protocol. The cache coherency protocol can signal when the main memory is being updated and when the update has finished. The processing entities can be configured to wait for the main memory to be updated or can access previously stored memory.

Cache coherence protocol for persistent memories

Subject matter disclosed herein relates to a system of one or more processors that includes persistent memory.

Persistent memory for processor main memory

A memory module houses stacked memory devices and a memory controller each having a near-field interface coupled to loop antennas to communicate over-the-air data. A coil is formed on a memory device substrate or molded into a plastic mold to create near-field magnetic coupling with the stacked memory devices and the memory controller.

High-speed wireless serial communication link for a stacked device configuration using near field coupling

Growing community of inventors

Rancho Cordova, CA, United States of America

Mostafa Naguib Abdulla