Kateeva, Inc.

Aprion Digital Ltd.

Idanit Technologies Ltd.

Digiflex Ltd.

Hewlett-Packard Industrial Printing Ltd.

Magnus Metal Ltd.

Moshe Frenkel

Nava Shpaisman

Boaz Nitzan

Guy Peled

Naama Schur

Murray Figov

Yosef Kamir

Oleg Berezin

Lior Lifshitz

Yacov Mazuz

Roi Levi

Narda Ben-Horin

Hani Farran

Valeriya Frid Zaid

Michael Letuchi

Joseph Kaplan

Artem Zhilin

Orel Birodker

Hana Arini Yadid

Yaacov Mazuz

Natalia Ivanova

Eitan Cohen

Methods and composition sets for forming etch-resist masks on a metallic surface are provided. The method may include depositing a first aqueous composition comprising a first reactive component onto a metallic layer of a substrate; depositing a second aqueous composition comprising a second reactive component on selected portions of the deposited first aqueous composition to form, from a chemical reaction between the first reactive component and the second reactive component, a bi-component material mask in a pattern to protect selected regions of the metallic layer; and depositing an etch solution to remove the metallic layer in regions not protected by the bi-component material mask.

Methods for producing an etch resist pattern on a metallic surface

The disclosure concerns printable refractory compositions, more particularly ceramic-based pastes for 3D printing of molds for additive metal casting. In particular, the present disclosure concerns composition for forming mold regions having controlled thermal conductivity and dissipation and controlled release of gaseous products therefrom during heating to mitigate mechanical failure risks in an additive casting process of metal objects.

Mold compositions for additive casting of metal objects

A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface-activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch-resist mask.

A method of making a device patterned with one or more electrically conductive features includes depositing a conductive material layer over an electrically insulating surface of a substrate, depositing an anti-corrosive material layer over the conductive material layer, and depositing an etch-resist material layer over the anti-corrosive material layer. The etch-resist material layer may be deposited over the anti-corrosive material layer, and the anti-corrosive material layer forming a bi-component etch mask in a pattern resulting in covered portions of the conductive material layer and exposed portions of the conductive material layer, the covered portions being positioned at locations corresponding to one or more conductive features of the device. A wet-etch process is performed to remove the exposed portions of the conductive material layer from the electrically insulating substrate, and the bi-component etch mask is removed to expose the remaining conductive material. Systems and devices relate to devices with patterned features.

Methods of etching conductive features, and related devices and systems

A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface- activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch resist mask.

Methods and composition sets for forming etch-resist masks on a metallic surface are provided. The method may include applying a composition comprising a first reactive component onto a metallic surface to form a primer layer; and image-wise printing by a nonimpact printing process on the primer layer another composition comprising a second reactive component to produce an etch-resist mask, wherein when droplets of the second composition contact the primer layer, the reactive components undergo a chemical reaction so as to immobilize the droplets. The set may include a first liquid composition comprising a fixating reactive component and a second liquid composition comprising an etch-resist reactive component, wherein the fixating reactive component and the fixating reactive component are capable undergoing a chemical reaction to form a bi-component material that is insoluble in water and in an acidic etch solution.

A process is provided for printing a high resolution pattern on a photopolymeric surface.

Process for producing a photomask on a photopolymeric surface

Provided is a process for dry, solvent free, transfer of solid material onto a flexographic plate.

Process for dry-coating flexographic surfaces

A pretreatment liquid for applying to the upper surface of a recording media, prior to printing of printing applications using water-based ink, is provided. The liquid comprises a polyvalent metallic salt and at least one of a polymer swelling and a coalescence reagent.

Pretreatment liquid for water-based ink printing applications

A method of making a printing plate in which the uncoated surface of a substrate is treated with a pre-treatment solution prior to the deposition of ink on the surface. The pre-treatment liquid comprises a polyvalent metal salt, and at least one of an organic swelling reagent and/or a coalescence reagent. The pre-treatment liquid is applied to form a thin, homogenous layer of approximately 4 &#x3bc;m to the entire upper surface of the recording plate. The swelling reagent and/or the coalescence reagent and the polyvalent metal cations are physically well localized in the porous structure of the plate's surface. After partial drying of the pretreated anodized aluminum plate, CTP liquid is deposited onto the surface to form an image. The CTP liquid solids react with the pre-treatment liquid and are, therefore, chemically bound to the surface. This allows all data to be deposited in a single pass of the inkjet head without the problem of clustering.

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Jerusalem, Israel

Moshe Frenkel