Inductev, Inc.

Moses M Keener

Andrew William Daga

Francis J McMahon

Bruce Richard Long

John M Wolgemuth

Benjamin H Cohen

Peter C Schrafel

Andrew W Daga

Francis J Mcmahon

A thin resonant induction wireless power transmission transfer coil assembly designed for low loss and ease of manufacturing includes one or more printed circuit boards having a first conductor pattern wound in a spiral on a first side and a second conductor pattern wound in a spiral on a second side thereof, where the second conductor pattern is aligned with the first conductor pattern whereby the second conductor pattern reinforces magnetic flux generated by the first conductor pattern. The first and second conductor patterns are placed relative to one another so as to provide flux transmission in a same direction. One or more of such printed circuit boards form a wireless power transmission coil assembly with a conductive winding layer, a ferrite flux diversion layer, conformal spacing layers, an eddy current shield layer and an assembly enclosure.

Wireless power transfer thin profile coil assembly

Growing community of inventors

Philadelphia, PA, United States of America

Moses M Keener