Tokyo Shibaura Denki Kabushiki Kaisha

Kabushiki Kaisha Toshiba

Tokyo Shibaura Electric Co., Ltd.

Toshiba Chemical Products Co., Ltd.

Moriyasu Wada

Shuichi Suzuki

Shuzi Hayase

Takeo Ito

Yasunobu Onishi

Toshihiko Oguchi

Yukihiro Mikogami

Shiroh Saitoh

Akira Yoshizumi

Tadashi Ido

Hiroki Honda

Hirotaka Yokoyama

Nagao Kaneko

Hirotoshi Ikeya

Akio Ishizawa

Hirohisa Kato

Yuusuke Wada

Shinichi Sanada

Toshimitsu Asano

Yoshiyasu Koike

Shuzi Havase

Katuya Kumagai

Takashi Kamo

Sadao Kajiura

A photo-curable epoxy resin type composition which comprises (a) an epoxy resin, (b) at least one compound selected from the group consisting of (i) a compound having a group, other than an imido group, which is represented by the formula --CONH and (ii) an aromatic amine, (c) an organic metal compound, where said metal is selected from the group consisting of titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, zinc, aluminum and zirconium; and (d) an organic silicon compound having at least one group selected from the group consisting of a peroxysilyl group and an o-nitrobenzyloxy group capable of forming a silanol group by irradiation with light. The photo-curable epoxy resin type composition according to this invention is capable of readily curing by light (ultraviolet ray in particular) and also capable of heat curing at a temperature of 150.degree. C. or more, and yet provides a cured product that is free of ionic impurities, does not corrode metallic materials which may be in contact with the composition, and displays excellent electrical properties.

Photo-curable epoxy resin type composition

An ultrasonic coupling agent of low viscosity which comprises at least one aqueous solution selected from an aqueous ethyl alcohol solution and an aqueous glycerin solution, and 75 to 0.1% by weight based on the total weight of the agent of silicone-based oil which is substantially soluble in the aqueous solution. The ethyl alcohol solution is preferably included in the ultrasonic coupling agent in an amount sufficient to invest the agent with a disinfection effect.

Ultrasonic coupling agent

A photopolymerizable epoxy resin composition comprising (a) an epoxy resin and (b) a heteropoly-acid aromatic sulfonium salt or a heteropoly-acid aromatic iodonium salt as a photocuring catalyst exhibits rapid photopolymerization, with the cured product being great in hardness, the corrosive action being weak, and the electrical properties being excellent. The industrial utility of the composition is therefore substantial.

Photopolymerizable epoxy resin composition

A photocurable composition comprising (1) an epoxy compound having at least one epoxy group and at least one unsaturated double bond in the same molecule; (2) a metal compound present in an amount ranging from 0.001 to 10 wt. %, based on the epoxy compound; and (3) a silicon compound which is capable of forming a silanol group when irradiated with light and which is present in an amount ranging from 0.1 to 20 wt. %, based on the epoxy compound, is characterized by a particularly rapid curing rate.

Photocurable composition

Disclosed are photocurable compositions which comprise

There is disclosed a photo-curable epoxy resin type composition comprising an epoxy resin, an aluminum compound, a silicon compound having a peroxysilyl group and a photosensitizer. The compositions of the present invention can suitably be used for wide varieties of electrical applications.

Photo-curable epoxy resin composition

There is disclosed a resin composition comprising

Resin composition

Disclosed is a magnetic recording medium, characterized in that 5 to 100 parts by weight of hexagonal ferrite particles having an average particle diameter of 0.01 to 0.2 .mu.m and 100 parts by weight of ferromagnetic particles having a saturation magnetization of 72 to 220 emu/g and an average particle diameter larger than that of the hexagonal ferrite particles are dispersed in a resinous binder.

Magnetic recording media having ferromagnetic and ferrite particles in

Disclosed is a magnetic recording medium comprising substrate and a resinous composition containing magnetic particles of uniaxially-anisotropic hexagonal crystals having particle diameters of 0.01.about.0.3 .mu.m and coated on said substrate; the ratio of remanent magnetization to saturation magnetization on the magnetization curve corrected to demagnetizing field which is measured in a direction vertical to the surface of the recording medium, ranging from 0.3 to 0.7. This magnetic recording medium requires no orientation treatment for its production.

Magnetic recording media

An epoxy resin-based compositions contain epoxy resins and a catalytic amount of curing catalysts which comprise organosilicon compounds having at least one hydroxyl group directly bonded to silicon atom and a compound having organic groups of aluminum, iron or vanadium.

Organosilicon-organometal compositions as epoxy curing catalysts

An epoxy resin-based composition contains epoxy resins and a catalytic amount of latent curing catalysts which comprise organosilicon compounds having hydrolyzable groups and aluminum compound having organic groups.

Epoxy resin-based compositions

A thermosetting resin composition containing as essential resin components (a) a maleimide compound modified with furfuryl alcohol, (b) an epoxy resin and (c) a polyvinyl formal, and a latent curing agent or a curing accelerator which is at least one compound selected from the group consisting of dicyandiamide, boron trifluoride-amine complexes, metal chelate compounds, and silicone compounds and organo-silane compounds having at least one hydroxyl group bonded directly to silicon atom, is found to be capable of B-staging with good storage stability and provides a heat-resistant resin composition having excellent electric characteristics at high temperatures after curing. The composition can suitably be coated on a glass cloth or a mica tape to give a pre-preg tape which can maintain its flexibility for a long time.

Heat-resistant thermosetting resin composition

A semiconductor device sealed in a resin composition, wherein the resin composition contains the prescribed percentages of inorganic fillers having extremely small amounts of impurities, epoxy resin having an epoxy equivalent of 250 or less and a softening point of 120.degree. C. or less, hardening agent, hardening promoter and low melting paraffins.

Resin-sealed semiconductor device

A heat-resistant resin composition having for its essential components (A) at least one maleimide compound obtained by reacting a condensation product of aniline, a phenolic compound and formaldehyde with an acid anhydride reactant containing at least 40 mole percent of maleic anhydride and (B) at least one compound selected from the group consisting of polyallyl phenyl ether compounds and polyallylphenolic compounds each having at least two allyl radicals.

Heat-resistant resin composition

Resin compositions comprising maleimide compounds obtained by reacting maleic anhydride with mixed polyamines produced by reaction between aniline and formaldehyde; diallylbisphenol compounds; and epoxy resins. The compositions display prominent heat resistance when hardened.

Growing community of inventors

Ninomiya, Japan

Moriyasu Wada