Sicoya Gmbh

Moritz Grehn

Stefan Meister

Sven Otte

Sebastian Höll

Marco Vitali

Hanjo Rhee

Christoph Theiss

Thorsten Kettler

Andreas Hakansson

Chenhui Jiang

Gan Zhou

David Selicke

Mischa Gehring

Andrea Zanzi

Sebastian H Ll

The invention relates to a switch system comprising one or more optical transceiver assemblies () connected to a switch ASIC ().

Assembly of network switch ASIC with optical transceivers

A photonic component having a photonically integrated chip and a fibre mounting, wherein the fibre mounting has: at least one groove, into which an optical fibre is placed, and at least one mirror surface, which reflects radiation from the fibre in the direction of the photonically integrated chip and/or reflects radiation from the photonically integrated chip in the direction of the fibre. A chip stack comprising at least two chips is arranged between the photonically integrated chip and the fibre mounting, the chip stack has at least two through holes and in each case a guide pin, which positions the chip stack and the fibre mounting relative to one another, passes through the at least two through holes of the chip stack.

Photonic component and method for production thereof

An exemplary embodiment of the invention relates to an optical connector comprising a wave-guiding element and a lens device configured to transmit radiation between the wave-guiding element and at least one optical port of the connector, wherein the lens device comprises a first outer surface and a second outer surface opposite the first outer surface, wherein the first outer surface is connected to the wave-guiding element and forms at least one lens, and wherein a section of the second outer surface opposite said at least one lens forms said at least one optical port of the connector.

Optical connector

The invention relates to a photonic component () having a photonically integrated chip () and a fibre mounting (), wherein the fibre mounting () has: at least one groove (), into which an optical fibre () is placed, and at least one mirror surface (), which reflects radiation (S) from the fibre () in the direction of the photonically integrated chip (). According to the invention a chip stack () comprising at least two chips is arranged between the photonically integrated chip () and the fibre mounting (), the chip stack () has at least two through holes () and in each case a guide pin (), which positions the chip stack () and the fibre mounting () relative to one another, passes through the at least two through holes () of the chip stack ().

The invention relates to optical devices comprising polarization diversity couplers. An embodiment of the invention relates to an optical device comprising a polarization diversity coupler configured to receive a beam of optical radiation. The optical device may further comprise a phase shifter, a 2&#xd7;N coupler, a photodetector and a control unit configured to generate a control signal based on a monitor signal of the photodetector.

Optical device

A photonic component that includes a photonically integrated chip and a fiber holder that is mechanically connected to said chip. The fiber holder includes at least one groove with an optical fiber laid therein. The chip includes a substrate whose substrate base material is a semiconductor material, an integrated optical waveguide that is integrated into one or more material layers of the chip, which layers are wave guiding and positioned on the substrate, a coupler formed in the optical waveguide or connected to said optical waveguide, particularly a grating coupler, and an optical diffraction and refraction structure that is integrated into one or more material layers of the chip which are positioned above the optical coupler when viewed from the substrate, and that shapes the beam prior to its being coupled into the waveguide or after being coupled out of the waveguide.

Photonic component and method for producing same

An embodiment of the invention relates to an optical assembly comprising an optical emitter configured to generate a beam of optical radiation, a cap unit holding the optical emitter, a photonic chip comprising a coupler, and an intermediate chip arranged between the cap unit and the photonic chip, wherein the cap unit comprises a recess having a bottom section and a sidewall, wherein the optical emitter is mounted on the bottom section of the recess, wherein a section of the sidewall forms a mirror section angled with respect to the bottom section and configured to reflect said beam of optical radiation towards the coupler, and wherein the intermediate chip comprises a lens formed at a lens section of the intermediate chip's surface that faces the cap unit, said lens being configured to focus the reflected optical beam towards the coupler.

Optical assembly

An embodiment of the invention relates to an optical assembly comprising a circuit board comprising a first side, a second side, and at least one hole that extends through the circuit board, a photonic chip having a front side and a back side, the front side of the photonic chip being mounted on the first side of the circuit board and electrically connected to at least one electrical conductor of the circuit board, at least one component being mounted on the front side of the photonic chip opposite the hole and protruding from the front side of the photonic chip into the hole or through the hole, and a wave-guiding element that is located on the second side of the circuit board and optically coupled to the photonic chip through said hole.

Growing community of inventors

Berlin, Germany

Moritz Grehn