Fujitsu Corporation

Moritoshi Ando

Hiroyuki Ikeda

Satoshi Iwata

Sachihiro Youoku

Satoru Sakai

Takefumi Inagaki

Hiroyuki Tsukahara

Yoshitaka Oshima

Kikuo Mita

Yoshikazu Kakinoki

Hiroshi Oka

A bottom wall of a Petri dish used for capturing a cell is provided with a first through hole and a second through hole. A grove that connects the first through hole and the second through hole is formed on an outer surface of bottom wall. The first through hole, the second through hole, and the grove is covered with a transparent plate member. A plate used for capturing the cell is arranged in the Petri dish above the first through hole. An aspiration tube is connected to the second through hole from inside the Petri dish.

Apparatus for capturing cell

A microinjection apparatus, which injects an object into a cell with a needle, acquires a first image that is an image of the cell at a first focal position and a second image that is an image of the cell at a second focal position, and decides a state of the cell based on a difference image obtained from the first image and the second image. Execution of such sequence of processing makes it possible to measure a state of a cell without involving human work and confirm the state of the cell in performing a microinjection, without a necessity of experienced skill, efficiently, and simply.

Microinjection apparatus and automatic focal point adjustment method

A microinjection apparatus of the present invention includes a needle-position polarity detecting unit that detects a position of the needle in the vertical direction at which a value of a differential aggregate distribution becomes the maximum in the situation in which a shape of the leading edge of the needle at a focal position narrows at the right. Moreover, a differential-average determining unit, based on a differential average of an image near the position detected by the needle-position polarity detecting unit, determines the lowest allowable position of the needle, which is a position at which a differential average exceeds a predetermined threshold.

Microinjection apparatus and microinjection method

A surface of a cell is irradiated with laser beam to make an opening in the cell membrane, and a drug fluid is inserted in the cell through the opening.

Apparatus and method for injecting substance into cell

An apparatus of the invention is for injecting a solution into a cell. The apparatus includes a nozzle that jets a solution to a cell, and a laser irradiating unit that irradiates a laser to the cell to form an opening through which the solution jet from the nozzle is introduced into the cell. The nozzle jets the solution toward a nucleus of the cell, and the laser forms the opening in the cell at a point in a cell membrane of the cell such that the solution can be applied on the nucleus.

Apparatus for injecting solution into cell

A method of measuring a wire-shaped object comprises a scanning step of scanning a light beam on the surface of the wire-shaped object, a detection step of detecting a reflected light reflected from the surface of the wire-shaped object by a plurality of optical sensor cells, the optical sensor cells being mounted on an inner wall of a reflected light detection unit located over the wire-shaped object; and a measurement step of measuring a three-dimensional configuration of the wire-shaped object in accordance with output signals from the plurality of optical sensor cells, whereby, the three-dimensional configuration of the wire-shaped object is automatically measured in a short time.

Method and apparatus for measuring three-dimensional configuration of

A method of detection of a wiring pattern using triangulation to detect a height thereof, comprising the steps of scanning a light beam from a light source, illuminating the wiring pattern to be detected by the scanned light beam, focusing the light reflected from the wiring pattern or a substrate, applying the focused light beam to a beam-splitter, and converting a wiring pattern configuration to a corresponding electric signal. Further, by blurring the focused light entering the beam-splitter, an expansion of a measurable height domain of the wiring pattern is possible. Furthermore, by applying a correction factor in response to the height of the substrate, the detected output of the wiring pattern height for a curved substrate can be sliced with a more appropriate slice level. Further, the beam-splitter comprises a reflection portion, a half reflection and half transmission portion, and a transmission portion. The width of the half reflection and half transmission portion is such that an upper and lower threshold value of the height of the wiring pattern can be determined, and thus the allowable limits of the wiring pattern height can be more accurately detected.

Wiring pattern detection method and apparatus

An improved pattern inspection system for automatically inspecting patterns on a printed circuit board, a semiconductor chip, etc. The pattern inspection system includes an optical sensor, a binary conversion circuit, a memory storing binary converted data in a matrix form, a length measurement circuit, a reference circuit and a determination circuit. The length measurement circuit includes a gate unit for picking-up the binary converted data array from the memory in radial directions with respect to an origin and for a predetermined length in each direction, a unit for measuring radii of the pattern in the radial directions from the origin in response to the picked-up binary converted data, a unit for determining a center line of the pattern in the picked-up binary converted data array by the measured length of the first directions, and a unit for encoding the measured length of the second directions to numerals each corresponding to one length of each of the second directions. The reference circuit receives the coded numerals for a reference pattern and forms a coded reference in response to the coded numerals. The determination circuit receives coded numerals for a inspection pattern, compares a code in response to the received coded numerals with the coded reference in the reference circuit, and determines a fault in the inspection pattern.

Pattern inspection system

A method of and apparatus for visual inspection of the condition of soldered connections between connector pads of a wiring pattern provided on a circuit board and tips of conductor pins of an IC package mounted thereby on the circuit board. The back, or bottom surface of the circuit board is illuminated by a flood of light to produce diffused, or scattered, light in the gap between the circuit board and the IC package, which diffused light is emitted from the edge of the gap. The emitted light is deflected by a small prism disposed adjacent the edge of the gap into a focusing means, such as a stereoscopic microscope having a long focal distance and an optical axis oriented substantially perpendicularly to the surface of the circuit board. Images of the soldered connections are observeable through the eyepiece of the microscope, or are detected by a photoelectric transducer such as a video camera for display on a video screen.

Method and apparatus for visually examining an array of objects disposed

In inspecting plated through holes in printed circuit boards, light from a light source is introduced into the light conducting substrate of the printed circuit boards having through holes. A light detector senses the light in the holes. The detected through holes are masked to prevent the light from entering the through hole of the substrate. A light detector senses light leaked to the hole. By signals supplied from the light detectors, the plated through holes can be continuously and efficiently inspected.

Method and apparatus for inspecting plated through holes in printed

A light scanning apparatus comprises a disk having a plurality of holograms, and a laser beam source for radiating and directing a laser beam (which functions as a reproduction wave) onto the holograms in a sequential order, wherein each of the holograms converges the laser beam toward a corresponding focal point. While the disk and the laser beam are moved relative to each other, the focal point scans an object to be scanned in a particular scanning direction. The laser beam acting as a reproduction wave is preferably a spherical wave laser beam. The holograms are constructed by a process in which both a spherical wave laser, acting as a reference wave, and a plane wave laser are applied to a photosensitive layer which is to be constructed as the hologram, in which process the plane wave laser beam is applied onto the photosensitive layer at a predetermined gradient forming an offset angle between the direction in which the plane wave laser is oriented and the direction in which the photosensitive layer extends.

Holographic disk scanner

A light scanning system is described, comprising a circular disk having a plurality of zone-type lenses, where each of the zone-type lenses converges an incoming light beam toward a corresponding focal point, and when moving said circular disk and said incoming light beam relatively each other, said focal point scans object to be scanned in a scanning direction.

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Kawasaki, Japan

Moritoshi Ando