Nichia Corporation

Morito Kanada

Ryosuke Wakaki

Hideo Asakawa

Kensaku Hamada

A resin package includes a molded resin housing, a first lead, and a second lead. The molded resin housing includes a cavity open upward. The cavity includes an inner surface. The inner surface includes a curved portion and a stepped portion provided on a lower side of the curved portion. The first lead and the second lead are provided in a bottom portion of the cavity such that at least a part of the first lead and the second lead is exposed from the molded resin housing. The first lead includes an elevated portion on which a light emitting element is mounted. An upper surface of the elevated portion is provided higher than an upper end portion of the stepped portion.

Resin package and light emitting device

A light emitting device includes a plurality of light emitting elements, a plurality of lead frames, and a package. The light emitting elements are mounted on the lead frames. The package is made of resin. The package has an opening. A part of the lead frames is embedded in an inner portion of the package and another part of the lead frames is exposed on a bottom surface of the opening. A resin bottom surface on which the resin is exposed is provided on the bottom surface of the opening of the package. The package includes a wall portion projecting from the bottom surface of the opening between the light emitting elements in the opening. The light emitting elements are connected by wire that straddles the wall portion.

Light emitting device

A light emitting device has a package having an opening provided with a side surface and a bottom surface, and a lead frame exposed to the bottom surface. The lead frame includes a reflection portion bent on the side surface, and a portion of an inner wall surface of the reflection portion is positioned in an inner portion of the package. A light emitting device has a package having a recessed portion on a front surface, a lead frame exposed to a bottom surface of the recessed portion, a light emitting element disposed on the lead frame, and a sealing resin filled into the recessed portion. The lead frame includes a bent portion bent towards the front surface of the package in the recessed portion, and a projecting portion bent to project from the package towards an outer portion, and disposed on a face opposed to the front surface.

Growing community of inventors

Tokushima, Japan

Morito Kanada