Hitachi, Ltd.

Kabushiki Kaisha Toshiba

Hirose Electric Company, Ltd.

Ddk Ltd.

Daiichi Denshi Kogyo Kabushiki Kaisha

Morio Suzuki

Takayuki Ono

Kiyoshi Matsui

Kenichi Kasai

Mitugu Shirai

Tsutomu Imai

Hideyuki Fukasawa

Toshitaka Murakawa

Takeshi Kuroda

Takeji Siokawa

Kiyofumi Tanaka

Yasushi Nishi

Mami Mizutani

Tatsuya Arai

Hirokatsu Yaegashi

Tomonari Otsuki

Takashi Morimoto

Hiroshi Ohkawa

Sadao Kuboi

Hiroshi Kozai

Hiroyuki Moriuchi

Takehiro Usumori

Hironobu Aoki

Yuuki Kuwano

Toshiaki Suzuki

Hiroshi Kouzai

Toshiaki Fujino

Matsuo Katoh

An assembled battery system is disclosed that includes a plurality of serially-connected battery cells; voltage detecting lines connectable at one ends to electrodes of the battery cells of the assembled battery; electric resistors serially-connected at one ends to the other ends of the voltage detecting lines; capacitors connected to the other ends of the electric resistors, each of the capacitors being configured to electrically interconnect one of the voltage detecting lines and the other voltage detecting line; voltage measuring circuits connected respectively to each of the voltage detecting lines; electrically openable short-circuiting switches arranged between the capacitors and the voltage measuring circuits and parallel-connected to the capacitors; and a monitoring circuit that detects a difference between a first measurement result and a second measurement result with respect to each of the short-circuiting switches and a failure of the voltage detecting lines, the short-circuiting switches or the voltage measuring circuits.

Assembled battery system and failure detection method of assembled battery system

A multicore cable includes a plurality of cables in parallel and is formed by fusion-welding the plurality of cables with a resin jacket. Each of the plurality of cables is formed by winding a shield around a signaling core wire, which is covered with an insulating material, and a grounding core wire. The resin jacket and the shield are stripped so that a stair portion is formed. The stair portion is coated with an electrically conductive adhesive. A vibration is exerted on the grounding core wire, thereby connecting the shield with the grounding core wire with the electrically conductive adhesive. Eventually, the shield and the grounding core wire are bonded with the electrically conductive adhesive. This allows an electrical connection between the shield and the grounding core wire to be maintained in a desirable condition, thus making it possible to suppress a characteristic impedance variation of the signaling core wire caused by an external factor.

Multicore cable and a method of manufacturing thereof

A multi-pin connector has contact pins fixedly soldered into bottomed connection holes which are in desired positions on a printed board, so that the contact pins are arrayed in a desired form without a housing. The multi-pin connector can be manufactured in a short period of time and can have any pitch, any number of pins and any shape.

Electronic device and multi-pin connector therefor

A multi-pin connector for mounting other boards or electronic parts on a main board, has contact pins fixedly soldered into bottomed connection holes which are in desired positions on the main board, so that the contact pins are secured separately and arrayed in a desired form without a housing. The contact pins have contact portions and pin portions, with the pin portions being secured in the connection holes.

Multi-pin connector

An electronic part, particularly a microstructure contact having an overall length of the order of 5 mm for an electrical connector or the like is provided with a nickel oxide layer portion having a nickel oxide layer of the order of 50 to 5000 .ANG. in thickness formed by anode oxidizing process using a solution mainly consisting of an alkaline solution. The nickel oxide layer portion is located between a terminal portion of the electronic part to be soldered as in a surface mounting process and a contact portion continuous to and extending from the terminal portion. The nickel oxide layer has a width of the order of 0.2 to 1 mm in the longitudinal direction of the contact and has a performance preventing the flowing of molten solder, thereby effectively preventing the flowing and wicking due to wetting of solder of the solder-plated portion toward the other portions as in the surface mounting process.

Electronic part

A pin contact of a connector includes a parallel portion which touches a contact portion of a contact spring portion of a socket contact when the pin contact is fitted into the socket contact, and an inclined portion to be inserted into the contact spring portion while forcibly opening the contact spring portion at the time of insertion. The inclined portion has a shape which is a combination of a curve portion and a linear portion, the curve portion being moderate in inclination in the area of a boundary point between the curve portion and the parallel portion while sharp in inclination in the area of a contact start point at a pointed end of the contact pin contact. The linear portion has a constant inclination angle. The insertion force of the pin contact increases linearly proportionally to the fitting depth of the pin contact into the socket contact while the linear portion is touching the contact spring portion, whereas the insertion force of the pin contact is kept constant regardless of the fitting depth while the curve portion is touching the contact spring portion of the socket contact at a point over the boundary point between the linear portion and the curve portion.

Pin contact and electric parts having the same

Ends of contact pins are inserted into bottomed connection holes which are in desired positions on a printed board, so that the contact pins are arrayed in the desired form. By effecting solder reflow in this state, the contact pins are fixedly soldered to the connection holes. A multi-pin connector is thus provided, which can be manufactured with ease in a short period of time and which can have any pitch, any number of pins and any shape.

Method of making multi-pin connector

A print substrate connector having a main body comprising a pair of supporting portions. A lock arm 26 is provided on a sidewall of a substrate mounting groove 22 formed in the main body of the substrate connector, into which groove 22 a terminal connecting portion 30 of the print substrate 29 is inserted. The part of the sidewall of the substrate mounting groove 22, on which part the lock arm 26 is placed, faces a vacant portion at the sides of the terminal connecting portion 30 of the print substrate 29, on which vacant portion no element is mounted. In operation or when the print substrate 29 is inserted into the mounting groove 22 of the main body, a locking claw 28 formed on the lock arm 26 is adapted to engage with a locking hole 32 formed on the vacant portion of the print conveniently used as a locking means of the substrate without a bad influence on a high density mounting of elements mounted on the substrate. A supporting foundation 34 of the lock arm 26 placed in parallel with the inner face of the sidewall of the connector main body 20a and has a forked end leaving a dent 35 on the bottom face of the forked end.

Substrate connector

A contact of a connector made of an elongated resilient material and having an inner end fixed to a connector housing and a midway to be in contact with a mating contact of another connector. According to the invention, the contact comprises a substantially straight portion extending from a contacting portion of the midway with the mating contact to the fixed inner end, and an outer portion being bent in zigzag extending from the contacting portion to the distal end abutting against a surface of the connector housing, thereby obtaining a sufficient contacting resilient pressure to realize stable and reliable connecting condition with the mating contact and simultaneously achieving small-sized connectors and high speed signal transmission.

Contact of connector

Growing community of inventors

Hadano, Japan

Morio Suzuki