Fujitsu Corporation

Morimitsu Iwai

Masami Aoki

Toyoshi Kawada

Hiroshi Yoshimura

Norio Matsumoto

Kouichi Kawahara

A flat display unit has a chassis combining a display panel and circuit boards for driving the display panel into a unit in which the display panel and the circuit boards are mounted on respective opposite surfaces of the chassis. The chassis is provided with a bank (i.e., sidewall) extending about the periphery of opposite main surfaces of the chassis including at least the surface on which the display panel is mounted, perpendicularly to that surface and surrounding the periphery of the display panel, and hence protecting the display panel without requiring a protector, as is conventionally used during the processes of assembling, testing and transporting thereof. The chassis is also provided with through-holes and optionally with a cut-out, which are formed in the periphery of the chassis, for facilitating interconnections between the display panel and the circuit boards by flexible cables which pass therethrough.

Flat display unit and method fabricating same

The present invention relates to a driver IC packaging module and a parallel plate type display device incorporating the same, and a chassis structure for an IC module having a high heat radiation effect or a flat display device having a high heat radiation efficiency can be achieved. There is provided a driver IC packaging module which comprises a driver IC chip for driving a display electrode of the flat display panel , a substrate on which the driver IC chip is mounted, a flexible substrate having output wirings on one end of which connection terminals are provided and on the other end of which output terminals are provided so as to connect electrically at least the display electrode and output pads of the driver IC chip , and a structure in which the output pads of the driver IC chip and the connection terminals of the flexible substrate are connected directly and also a direction of exposed surfaces of the output terminals of the flexible substrate connected to the display electrode and a direction of a driver IC chip mounting surface on the substrate are directed oppositely.

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Miyazaki, Japan

Morimitsu Iwai