The Furukawa Electric Co., Ltd.

Morikuni Hasebe

Shinichi Ishiwata

Hiroyuki Nakae

Isamu Noguchi

Kazushige Iwamoto

Koji Nakayama

Kenji Mougi

Eiji Shiramatsu

There is disclosed a semiconductor wafer-securing adhesive tape having a radiation-curable adhesive layer on one surface of a support film, wherein the support film is composed of a laminated film that comprises, as a center layer, a film comprising a styrene/ethylene/butene/styrene block copolymer, a ethylene/acrylic acid-type copolymer, and a polyamide/polyether copolymer in a specific ratio, and has a layer for adhesive coating laid, directly or through a bonding layer, on one surface of the center layer on the side where said radiation-curable adhesive layer is provided, and has a transfer-preventing layer laid, directly or through a bonding layer, on the other surface of the center layer. There is also disclosed a semiconductor wafer-securing adhesive tape wherein the center layer of said semiconductor wafer-securing adhesive tape has a film comprising said SEBS block copolymer or SEPS block copolymer, an amorphous poly .alpha.-olefin, and a polyamide/polyether copolymer, in a specific ratio.

Semiconductor wafer-securing adhesive tape

Polyethylene base resin composition having highly filled with an

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Fujisawa, Japan

Morikuni Hasebe