Alpha Assembly Solutions Inc.

Other

Morgana De Avila Ribas

Siuli Sarkar

Bawa Singh

Ranjit Pandher

Rahul Raut

Sutapa Mukherjee

Pritha Choudhury

Ravi Bhatkal

Ramakrishna Hosur Venkatagiriyappa

Harish Hanchina Siddappa

Anil Kv Kumar

Nitin Vithalbhai Desai

Oscar Khaselev

Sathish Kumar

Monnir Boureghda

Anna Lifton

Ravindra Mohan Bhatkal

Nirmalya Kumar Chaki

Barun Das

Remya Chandran

Pavan Vishwanath

Shamik Ghosal

Ashok Pachamuthu

Nicholas G Herrick

Suresh Telu

Anil K N Kumar

Amit Patel

Traian Cornel Cucu

Shu Tai Yong

Ramakrishna Hosur Katagiriyappa

Anilkumar KN

Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.

Advanced solder alloys for electronic interconnects

A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

Sintering paste

A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.

Lead-free and antimony-free tin solder reliable at high temperatures

Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150&#xb0; C., for example up to 175&#xb0; C. The alloys may exhibit improved high temperature mechanical properties compared to the conventional Sn&#x2014;Ag&#x2014;Cu and Pb5Sn2.5Ag. The solder may be in the form of a bar, a stick, a solid or flux cored wire, a foil or strip, a film, a preform, or a powder or paste (i.e., a powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, or a reflowed or solidified solder joint, or pre-applied on any solderabie material such as a copper ribbon.

High reliability lead-free solder alloy

A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein:

Engineered polymer-based electronic materials

Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.

Rosin-free thermosetting flux formulations

Dual-side reinforcement (DSR) materials and methods for semiconductor fabrication. The DSR materials exhibit the properties of conventional underfill materials with enhanced stability at room temperature.

Dual-side reinforcement flux for encapsulation

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Bengaluru, India

Morgana De Avila Ribas