Lucent Technologies Inc.

Agere Systems Inc.

Agere Systems Guardian Corp.

Morgan J Thoma

Isik C Kizilyalli

William Thomas Cochran

Daniel Joseph Vitkavage

Ranbir Singh

Steven Alan Lytle

Mary Drummond Roby

Robert Alan Ashton

Edward P Martin

The present invention provides a process for fabricating merged integrated circuits on a semiconductor wafer substrate. The process comprises forming a gate oxide on the semiconductor wafer substrate, forming a first transistor having a first gate on the gate oxide, and forming a second transistor having a second gate on the same gate oxide. The first transistor is optimized to a first operating voltage by varying a physical property of the first gate, varying a first tub doping profile, or varying a first source/drain doping profile. The second transistor is optimized to a second operating voltage by varying a physical property of the second gate, varying a second tub doping profile, or varying a second source/drain doping profile of the second transistor. These physical characteristics may be changed in any combination or singly to achieve the determined optimization of the operating voltage of any given transistor.

Method for fabricating a merged integrated circuit device

The present invention provides a semiconductor device and method of manufacture thereof that provides improved dielectric thickness control. The semiconductor device includes a metal feature located on a semiconductor substrate, wherein the metal feature has openings formed therein, or depending on the device, therethrough. The semiconductor device further includes a fluorinated dielectric layer located over the metal feature and within the openings. Thus, the inclusion of openings within the metal feature allows for a substantially planar surface of the fluorinated dielectric layer.

Use of small openings in large topography features to improve dielectric thickness control and a method of manufacture thereof

The invention provides a method of planarizing an irregular surface of a semiconductor wafer. In one embodiment, the method comprises applying a photoresist material over recessed areas and protruding areas of the irregular surface, etching the photoresist, etching partially into protruding areas of the irregular surface to remove a portion of the irregular surface, and polishing the irregular surface to a substantially planar surface. In some embodiments method may include chemically and mechanically polishing the irregular surface.

Method of planarizing a surface on an integrated circuit

An apparatus and method for providing improved latch-up immunity in a semiconductor device such as a complementary metal-oxide-semiconductor (CMOS) integrated circuit. An exemplary apparatus includes a first region of semiconductor material of a first conductivity type, a well of semiconductor material formed in the first region and having a second conductivity type opposite to the first conductivity type, a first MOS transistor formed in the well and including a source region and a drain region formed of semiconductor material of the first conductivity type, and a second MOS transistor formed in the first region and having a source region and a drain region formed of semiconductor material of the second conductivity type. A conductive material or other suitable routing means is connected between the source region of one of the first or second MOS transistors and a corresponding voltage supply input of the device. In one embodiment, the routing means is formed of a semiconductor material having the same conductivity type as the source region, and may be a P.sup.+ or N.sup.+ active region. The source region of the first and/or second MOS transistor may be formed from a portion of the routing means.

Semiconductor device with increased parasitic emitter resistance and

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Orlando, FL, United States of America

Morgan J Thoma