Future Wei Technologies, Inc.

Huawei Technologies Co., Limited

Morgan Chen

Xiao Andy Shen

Yu Sheng Bai

Xueyan Zheng

Hongbing Lei

Dawei Zheng

Yuming Cao

Gong Tom Lei

Liang Gu

Yen Dang

Yifan Gu

Hungyi Lee

Chunlei Liao

Qianfan Xu

Rongsheng Miao

YuSheng Bai

Bo Li

Gong Lei

An optical transceiver comprising an optical signal input, a first modulation section coupled to the optical signal input, a second modulation section coupled to the optical signal input and positioned in serial with the first modulation section, wherein the first modulation section comprises a first digital electrical signal input, a first digital driver coupled to the first digital electrical signal input, and a first modulator coupled to the first digital driver, and wherein the second modulation section comprises a second digital electrical signal input, a second digital driver coupled to the second digital electrical signal input, and a second modulator coupled to the second digital driver, and an optical signal output coupled to the first modulation section and the second modulation section.

Digital optical modulator for programmable n-quadrature amplitude modulation generation

A method comprising coupling a circuit to an opto-electronic package via an anisotropic conductive film (ACF), wherein the opto-electronic package is configured to communicate electrical signals via the coupling at a maximum frequency of about 10 gigahertz (GHz) to about 40 GHz. An apparatus comprising, an opto-electronic package comprising a plurality of first electrodes, and a circuit comprising a plurality of second electrodes, wherein at least one of the first electrodes is coupled to at least one of the second electrodes via an ACF, and wherein the opto-electronic package is configured to communicate electrical signals via the coupling at a maximum frequency of about 10 GHz to about 40 GHz.

Miniature high density opto-electronic package

An electronic driver circuit for use with a modulator such as a segmented Mach-Zehnder Modulator (MZM) is provided. The electronic driver circuit includes a first delay buffer implemented as a first complementary metal-oxide-semiconductor (CMOS) inverter and a second delay buffer implemented as a second CMOS inverter. The second CMOS inverter follows the first CMOS inverter and has a second gate width smaller than a first gate width of the first CMOS inverter. The first CMOS inverter is configured to produce a first delayed electrical signal from a received electrical signal and the second CMOS inverter is configured to produce a second delayed electrical signal from the first delayed electrical signal produced by the first CMOS inverter.

Distributed mach-zehnder modulator (MZM) driver delay compensation

An apparatus comprising a first electrical driver configured to generate a first binary voltage signal according to first data, a second electrical driver configured to generate a second binary voltage signal according to second data, wherein the first data and the second data are different, and a first optical waveguide arm coupled to the first electrical driver and the second electrical driver, wherein the first optical waveguide arm is configured to shift a first phase of a first optical signal propagating along the first optical waveguide arm according to a first voltage difference between the first binary voltage signal and the second binary voltage signal to produce a first multi-level phase-shifted optical signal.

Digital generation of multi-level phase shifting with a Mach-Zehnder modulator (MZM)

An apparatus comprising a modulation block comprising a plurality of modulators, wherein each of the plurality of modulators comprises an optical input port and an optical output port, and wherein all of the optical input ports and all of the optical output ports are positioned on one face of the modulation block. Another apparatus comprising a modulation block comprising one or more Mach-Zehnder modulators (MZMs), wherein each MZM is coupled to an optical input port, an optical output port, and at least one electrical trace, wherein all of the optical input ports and all of the optical output ports are positioned on a first side of the modulation block, and wherein all of the electrical traces are positioned on a second side of the modulation block, and a planar lightwave circuit (PLC) coupled to the modulation block via an optical interface.

Hybrid integration using folded Mach-Zehnder modulator array block

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San Jose, CA, United States of America

Morgan Chen