Pri Automation, Inc.

Teledyne Limited

Other

Mordechai Wiesler

Mitchell Weiss

A wafer transfer system is operable with a front or side loading wafer carrier to move one or more wafers in a straight line from the carrier to a position in which the wafers are accessible for further processing by movement along the same straight line. The transfer system provides a wafer extractor which employs a plurality of paired fingers of a size and configuration to fit between the spaced, stacked wafers in the carrier. After insertion between the wafers, the fingers are movable by a small amount vertically to lift the wafers off the shoulders of the carrier. The fingers, now supporting the wafers, are movable generally horizontally along a straight line to remove the wafers from the carrier. The fingers are supported from a support structure in a manner which provides clearance for the wafers to pass through the support structure for further processing along the same straight line path.

Wafer transfer system having vertical lifting capability

Straight line wafer transfer system

A wafer transfer system is operable with a front or side loading wafer carrier to move one or more horizontally oriented wafers out of the carrier and to rotate the wafers to a vertical orientation in which the wafers are accessible for further processing. The transfer system provides a wafer extractor which employs a plurality of paired fingers of a size and configuration to fit between the spaced, stacked wafers in the carrier for lifting the wafers off the shoulders of the carrier. The fingers are then movable generally horizontally to remove the wafers from the carrier into two angled combs having ledges for receiving wafers. The fingers and combs are rotated to a vertical orientation in which the wafers are supported along their edges by the combs. The fingers are shifted horizontally a small amount relative to the combs to disengage from the wafers, either by a translation following the rotation or by rotating the fingers and combs about different axes. In this manner, the wafers are in a position from which they can be accessed by a robot arm according to the particular process. In a further embodiment, the fingers and combs are also translated forward during the rotation, thereby minimizing the floor space or footprint required by the system.

Wafer transfer system having rotational capability

A precision positioning device with a pair of relatively movable plates defining a carriage for four relatively movable guides. A centering port having a rectangular profile is formed by the guides which are constrained for mutually coating movement on the plates. The relative positions of the movable plates define the geometric shape of the centering port and the relative locations of the guides determine the size of the centering port. A pedestal configured to carry the article to be centered is positioned at the center of the centering port. A driver momentarily moves the guides and opens the centering port for reception of the article. Bias elements urge the guides against the item for centering the article on the collet.

Precision positioning device

A precision centering device with a pair of relatively movable plates forming a guideway for four relatively movable guides. A tapered centering port having a rectangular profile is formed by the guides which are constrained for mutual coacting movement by the plates. The relative positions of the movable plates define the geometric shape of the centering port and the relative locations of the guides determine the size of the centering port. A reciprocating collet configured to carry a semiconductor chip is received within the centering port at the center thereof. As the collet moves downwardly, the chip is guided through the tapered port and is centered on the collet.

Precision centering device

A weighing machine with a digital display and having a lever and coded disc that rotate about a common axis. The disc is constrained to rotate in the direction of the lever after a preset time delay, the lever rotating a distance related to the weight of an object placed on the machine. Indicia on the disc are counted during the time interval between initiation of disc rotation and the striking of a contact on the disc with a contact on the lever, the number of counts defining the weight of the object.

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Lexington, MA, United States of America

Mordechai Wiesler