Stats Chippac Pte. Ltd.

MoonKi Jeong

KyuWon Lee

JinGwan Kim

JiHoon Oh

SunYoung Chun

A method of manufacture of an integrated circuit packaging system includes: providing a base substrate having a base substrate top side; mounting a base integrated circuit over the base substrate top side, the base integrated circuit having an active side opposite an inactive side with the inactive side facing the base substrate top side; attaching a peripheral interconnect to the base substrate top side and a device peripheral pad of the base integrated circuit at the active side; mounting an interposer over the base integrated circuit and the peripheral interconnect, the interposer having an interposer top side and a window; and attaching a central interconnect to the interposer top side and a device central pad of the base integrated circuit at the active side, the central interconnect through the window.

Growing community of inventors

Icheon-si, South Korea

MoonKi Jeong