Denso Corporation

Innovative Technology Licensing LLC

Other

Osong Medical Innovation Foundation, Korea University Research and Business Foundation

Rockwell Scientific Licensing LLC

Moonil Kim

Jonathan Bruce Hacker

Makoto Tanaka

Kazuoki Matsugatani

John A Higgins

Dowon Kim

Won Ho Kim

Kook Joo Lee

Disclosed are a terahertz band waveguide module and a mounting method of an IC chip. The terahertz band waveguide module includes: a waveguide having a channel having a first size based on an E-plane; and an IC chip having a width of a second size and disposed at a preset position inside the waveguide, wherein the IC chip is disposed inside the waveguide with an air gap on at least two surfaces of the IC chip.

Terahertz band waveguide module and mounting method of IC chip

A line-waveguide converter includes a backside electrode disposed on a first face of a dielectric substrate, a waveguide attached to a second face of the dielectric substrate opposite the first face and having electrical conduction to the backside electrode, and multiple electrodes disposed inside the waveguide on the second face. The electrodes are identical in shape and size, and the intervals between adjoining ones of the electrodes are identical. At least one of the electrodes can be fed with power from a line.

Line-waveguide converter having plural electrode cells and radio communication device using such a converter

High frequency power amplification modules comprise a dielectric substrate supporting a stepped impedance transition coupled to the input of a power amplifier and a symmetrically disposed stepped impedance transition connected to the output of the power amplifier. The power amplification modules are oriented in an electromagnetic energy field so that input electromagnetic energy is coupled to the input of the power amplifier by the input side stepped impedance transition, amplified by the amplifier, and emitted from the module by the output side stepped impedance transition. A plurality of the power amplification modules may be organized into an array to provide a power combiner. The power amplification modules in the array may be linked by isolation impedances that decouple the modules in the array.

Compact stabilized full-band power amplifier arrangement

A first metal plate for transmission and a second metal plate for transmission are closely-attached to a first surface and a second surface of a dielectric body, respectively. An outer edge of the first metal plate substantially symmetrically faces an outer edge of the second metal plate via the dielectric body. A metal plate for matching is arranged inside a hole formed on the second metal plate, with a slit formed with an inner wall of the hole, and is fixed to the dielectric body. The metal plate for matching is electrically connected to the first metal plate via a through hole penetrating the dielectric body. An IC chip is surface-mounted to connect the second metal plate with the metal plate for matching.

IC tag and IC tag attachment structure

An antenna comprises a first conductive layer, a second conductive layer and an LC resonance circuit. The first conductive layer has plural elements and is disposed adjacently to each other. The second conductive layer is disposed at a predetermined distance from the first conductive layer via a dielectric substrate. The LC resonance circuit comprises connection for electrically connecting the elements and the second conductive layer. The LC resonance circuit takes a resonance state in which impedance becomes high in the operating frequency of the antenna. Of the plural elements, a power feeding section is provided in each of any two adjacent elements. Power is fed to the power feeding sections during transmission so that signals of the operating frequency are opposite in phase, and signals of the operating frequency inputted to the antenna are outputted in opposite phase from the power feeding sections during reception.

Antenna, radio device, method of designing antenna, and method of measuring operating frequency of antenna

A multi layered high impedance structure presents a high impedance to multiple frequency signals, with a different frequency for each layer. Each layer comprises a dielectric substrate, and an array of radiating elements such as parallel conductive strips or conductive patches on the substrate's top surface, with a conductive layer on the bottom surface of the bottommost layer. The radiating elements of succeeding layers are vertically aligned with conductive vias extending through the substrates to connect the radiating elements to the ground plane. Each layer presents as a series of parallel resonant L-C circuits to an E field at a particular signal frequency, resulting in a high impedance surface at that frequency. The new structure can be used as the substrate for a microstrip patch antenna to provide an optimal electrical distance between the resonator and backplane at multiple frequencies. It can also be used in waveguides that transmit multiple signal frequencies signals in one polarization or that are cross-polarized. As a waveguide it maintains a near-uniform density E and H fields, resulting in near uniform signal power density across the waveguide's cross-section.

High impedance structures for multifrequency antennas and waveguides

A multi layered high impedance structure presents a high impedance to multiple frequency signals, with a different frequency for each layer. Each layer comprises a dielectric substrate, and an array of radiating elements such as parallel conductive strips or conductive patches on the substrate's top surface with a conductive layer on the bottom surface of the bottommost layer. The radiating elements of succeeding layers are vertically aligned with conductive vias extending through the substrates to connect the radiating elements to the ground plane. Each layer presents as a series of parallel resonant L-C circuits to an E field at a particular signal frequency, resulting in a high impedance surface at that frequency. The new structure can be used as the substrate for a microstrip patch antenna to provide an optimal electrical distance between the resonator and backplane at multiple frequencies. It can also be used in waveguides that transmit multiple signal frequencies signals in one polarization or that are cross-polarized. As a waveguide it maintains a near-uniform density E and H fields, resulting in near uniform signal power density across the waveguide's cross-section.

High impedence structures for multifrequency antennas and waveguides

An improved waveguide wall structure and improved waveguide using the new wall structure as the interior walls of the waveguide. The wall structure comprises a sheet of dielectric material, a series of parallel conductive strips on one side of the dielectric material and a layer of conductive material on the other side. Multiple conductive vias are also included through the dielectric material and between the conductive layer and conductive strips. The new wall structure presents as a series of parallel L-C circuits to a transverse E field at resonant frequency, resulting in a high impedance surface. The wall structure can be used in waveguides that transmit a signal in one polarization or signals that are cross polarized. The new waveguide maintains a near uniform density E field and H field component, resulting in near uniform signal power density across the waveguide cross section.

Growing community of inventors

Seoul, South Korea

Moonil Kim