Samsung Electronics Co., Ltd.

Moonhee Oh

Reum Oh

Je Min Ryu

SeungHan Woo

BumSuk Lee

Jaeyoun Youn

A semiconductor die may include a first delay circuit formed on a substrate and configured to delay a test signal, the first delay circuit including first delay stages connected in series, a second delay circuit formed on the substrate and configured to delay the test signal, the second delay circuit including second delay stages connected in series, at least one through silicon via connected to at least one output terminal of output terminals of the first delay stages, the at least one through silicon via penetrating through the substrate, and a load determinator configured to compare a first delay signal output from one of the first delay stages with a second delay signal output from one of the second delay stages and determine a load of the at least one through silicon via.

Semiconductor die for determining load of through silicon via and semiconductor device including the same

A memory device includes a command decoder and a status circuit. The command decoder decodes a command. The status circuit sequentially stores operation information of the memory device determined based on the decoded command and outputs at least one of the sequentially stored operation information in response to an output control signal.

Growing community of inventors

Osan-si, South Korea

Moonhee Oh