Samsung Electro-Mechanics Co., Ltd.

Hyundai Motor Company

Korea Institute of Industrial Technology

Kia Corporation

Seoul National University

Kia Motor Corporation

Piezonics Co., Ltd.

Moon Soo Park

Chang Hak Choi

Jong Ho Lee

Dong Hun Kim

Hye Yeon Cha

Byung Kun Kim

Byung Chul Jang

Jae Hun Choe

Hwan Soo Lee

Dong Hwan Lee

Tae Young Kim

Hyung Tae Kim

Seung Taek Kim

Jong Seok Kim

Kang Heon Hur

Jung Min Park

Jin Ok Han

Young June Cho

Min Cheol Park

Jae Yeol Choi

Young Hoon Kim

Jin Young Kim

Jong Sik Yoon

Jae Seok Yi

Byung Soo Kim

Jeong Ho Yoon

Yu Na Kim

Sa Yong Lee

Byeung Gyu Chang

Sang Ho Shin

Dae Hyeong Lee

Ji Hyun Eom

Tae Hyeong Kim

Chul Soo Byun

Seong Min Chin

Byung Taek Kim

Keun Yong Lee

Jaichan Lee

Young Seok Choi

Geum Hee Yun

Ji Hun Shin

Jae Jin Hwang

Min Hee Kim

You Na Kim

Ju Whan Moon

Hyuk Jin Hong

Il Yong Chung

Kyung Tae Kang

Shin Hyoung Kang

Seon Ho Park

Kyung Chan Jin

Deok Keun Lee

Jin Woo Jang

Ji Hyun Yu

Kyung Han Ahn

Head lamp for an automobile

A multilayer ceramic capacitor (MLCC) includes a body including first dielectric layers and second dielectric layers, the body including first to sixth surfaces, a second surface, a third surface, a fourth surface, a fifth surface and a sixth surface; first internal electrodes disposed on the first dielectric layers, exposed to the third surface, the fifth surface, and the sixth surface, and spaced apart from the fourth surface by first spaces; second internal electrodes disposed on the second dielectric layers to oppose the first internal electrodes with the first dielectric layers or the second dielectric layers interposed therebetween, exposed to the fourth surface, the fifth surface, and the sixth surface, and spaced apart from the third surface by second spaces; first dielectric patterns disposed in at least a portion of the first spaces, and second dielectric patterns disposed in at least a portion of the second spaces; and lateral insulating layers.

Multilayer ceramic capacitor and board having the same

A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes, external electrodes disposed on the body to be connected to the internal electrodes, and a metal oxide disposed between the body and the external electrodes. The metal oxide includes calcium (Ca), zinc (Zn), and silicon (Si), and further includes at least one selected from the group consisting of barium (Ba), boron (B), and aluminum (Al).

Multilayer electronic component

A multilayer electronic component includes a body including a plurality of first dielectric layers, an active portion in which internal electrodes are alternately disposed, and a cover portion disposed the active portion in a first direction of the body, a direction in which the plurality of first dielectric layers are laminated, and including a second dielectric layer; and an external electrode disposed externally on the body and connected to one of the internal electrodes. The body includes a margin portion covering a side surface of the one of the internal electrodes other than a side surface connected to the external electrode and including a dielectric pattern having a porosity higher than that of one of the plurality of first dielectric layers.

An embodiment method for controlling heat dissipation of an LED lamp includes applying power to a first light source element to light the first light source element, generating a current using heat dissipation of the first light source element, supplying the current to a fan to drive the fan, and removing a residual heat of the first light source element using cold air generated by the fan.

Device and method for controlling heat dissipation of LED lamp for vehicle

The present invention relates to a head device of a three-dimensional modelling equipment, and a modelling plane scanning method using the same, the head device of a three-dimensional modelling equipment comprising: a modelling light source array having a plurality of modelling light sources; a light guide part, installed at a given position above a modelling plane, having a function of reflecting modelling rays from the modelling light source array so as to be incident on the modelling plane; and a controller for controlling the operations of the modelling light source array and the light guide part in a conjoined manner, wherein a plurality of modelling rays generated from the plurality of modelling light sources are irradiated while forming one line scan having a first axial direction on the modelling plane, and the light guide part continuously or intermittently moves the one line scan on the modelling plane to irradiate the modelling light rays across the modelling plane. The present invention has the effects of enabling high-speed scanning to be performed, and modelling precision to be enhanced through precise scanning control.

Head device of three-dimensional modelling equipment having modelling light source array and polygonal mirror, and modelling plane scanning method using same

The present invention relates to a multichannel head assembly for a three-dimensional modeling apparatus which can improve productivity by simultaneously or synchronously modeling a plurality of three-dimensional shaped objects having the same shape or different shapes, and a three-dimensional modeling apparatus using the same, the present invention comprising: a modeling light source unit for allowing N modeling beams to be incident to a light guide unit; the light guide unit for receiving the N incident modeling beams and having a function of guiding each of the N modeling beams along a predetermined path so as to allow the N modeling beams to be incident to N modeling planes in one-to-one correspondence with each other; and a control unit for controlling driving of the modeling light source unit and driving of the light guide unit to be linked with each other.

Multichannel head assembly for three-dimensional modeling apparatus, having polygon mirror rotating in single direction, and three-dimensional modeling apparatus using same

A head device of three-dimensional modeling equipment is disclosed which has unidirectionally rotating polygon mirrors, can perform biaxial scanning at a high speed due to a combination of the mirrors, can easily control timing and a modeling ray irradiation position, and can enhance modeling precision. A scanning method for a modeling plane using the same is also disclosed.

Head device of three-dimensional modeling equipment having unidirectionally rotating polygon mirrors, scanning method for modeling plane using same, and three-dimensional modeling device using same

A coil electronic component includes coil parts formed on both surfaces of a support part and a magnetic body enclosing the support part and the coil parts. The magnetic body includes a dipping coating part formed around the coil part, a core part formed inside the coil part, an outer peripheral part formed outside the coil part, and first and second cover parts formed above and below the coil part. The dipping coating part contains metal powder having shape anisotropy.

Coil electronic component with anisotropic parts and method of manufacturing the same

A multilayer electronic component includes a main body including an active region in which a plurality of internal electrodes are stacked with respective dielectric layers interposed therebetween, and upper and lower cover regions disposed above and below the active region, respectively, external electrodes disposed on external surfaces of the main body and electrically connected to the plurality of internal electrodes, and a composite body disposed below the lower cover region of the main body and lower portions of the external electrodes.

Multilayer electronic component including a composite body and method of manufacturing the same

A coil electronic component includes: a coil part; an insulating layer covering the coil part; a magnetic body enclosing the coil part covered by the insulating layer; and an adhesive layer disposed between the insulating layer and the magnetic body to prevent chipping of the magnetic body.

Coil electronic component and method for manufacturing the same

Growing community of inventors

Suwon-si, South Korea

Moon Soo Park