Skhynix Inc.

Tohoku University

Moon Sik Seo

Gil Bok Choi

Dae Hwan Yun

Tetsuo Endoh

Un Sang Lee

Hyun Seung Yoo

Kyung Sik Mun

A method of manufacturing a three-dimensional semiconductor memory device includes forming a preliminary channel hole through a vertical stack structure including first layers and second layers that are alternately stacked, oxidizing an inner surface of the preliminary channel hole to form a sacrificial layer, removing the sacrificial layer to form a final channel hole, and forming a channel plug in the final channel hole.

Method of manufacturing three-dimensional semiconductor memory device

A memory device, and methods of manufacturing and operating the memory device, include alternately stacked interlayer insulating layers and conductive layers, a vertical hole configured to pass through the alternately stacked conductive layers and interlayer insulating layers, first blocking layers formed along the interlayer insulating layers exposed through the vertical hole, and second blocking layers formed along the conductive layers exposed through the vertical hole, with each second blocking layer having a thickness greater than that of each of the first blocking layers. The memory device also includes charge trap layers formed on the same layer as the interlayer insulating layers, and surrounded by the first and second blocking layers, a tunnel insulating layer formed along inner walls of the second blocking layers and the charge trap layers, and a channel layer formed along an inner wall of the tunnel insulating layer.

Memory device, method of manufacturing memory device and method of operating memory device

A method of manufacturing a semiconductor device may include forming a stack with alternately stacked first material layers and second material layers, forming an opening passing through the stack, forming a memory layer in the opening, forming a slit passing through the stack and exposing the first material layers and the second material layers, and forming first barrier patterns, without removing the second material layers, by partially oxidizing the memory layer through the second material layers.

Semiconductor device and method of manufacturing semiconductor device

A memory system and a method of operating the memory system are provided. The memory system includes a plurality of semiconductor memory devices each of which includes a plurality of memory blocks. The memory system also includes a controller configured to control the plurality of semiconductor memory devices to perform a program operation, a read operation, and an operation of removing a hole in a space region on a target memory block of the plurality of memory blocks. The controller controls the plurality of semiconductor memory devices to perform the operation of removing the hole in the space region on the target memory block when an erase count of the target memory block of the plurality of memory blocks is greater than a set value.

Memory system and operating method of the memory system

Provided herein may be a memory device and a method of operating the same. The memory device may include a plurality of memory cells, a peripheral circuit, and a control logic. The memory cells may be coupled to a plurality of word lines. The peripheral circuit may perform a memory operation on selected memory cells. The control logic may control the peripheral circuit, during the memory operation, to apply an operating voltage to a selected word line, among the plurality of word lines, coupled to the selected memory cells, a first pass voltage to target word lines adjacent to the selected word line among unselected word lines, based on whether the operating voltage is lower than or equal to a reference voltage, and a second pass voltage, having a lower level than the first pass voltage, to remaining unselected word lines, other than the target word lines.

Memory device configured to apply first and second pass voltages to unselected word lines based on an operating voltage

Disclosed is an operating method of a controller for controlling an operation of a semiconductor memory device including a plurality of memory cells. In the operating method of the controller, program data to be stored in a selected page of the semiconductor memory device is generated, and the semiconductor memory device is controlled to program the program data in the selected page. Bit data at a predetermined position in the program data is data for allowing a threshold voltage of a corresponding memory cell to maintain an erase state.

Semiconductor memory device, controller, and operating method thereof

The present technology provides a semiconductor device and a method of manufacturing the same. The semiconductor device includes a channel structure, insulating structures surrounding the channel structure and stacked to be spaced apart from each other, interlayer insulating films surrounding the insulating structures, respectively, and a gate electrode extending from between the interlayer insulating films to between the insulating structures and surrounding the channel structure. The insulating structures may include protrusion portions extending to cover edges of the interlayer insulating films facing the channel structure, and the gate electrode may extend between the protrusion portions which are adjacent to each other.

Semiconductor device and method of manufacturing the same

A memory device includes a memory cell array having a plurality of memory strings and includes a voltage generating circuit configured to generate and apply a plurality of drain select line voltages, a plurality of source select line voltages, and a read voltage to the memory cell array during a read operation. The memory device also includes control logic configured to control the voltage generating circuit to generate a first drain select line voltage applied to a first unselected memory string among unselected memory strings among the plurality of memory strings and a second drain select line voltage applied to second unselected memory strings among the unselected memory strings during the read operation, wherein the second drain select line voltage is different from the first drain select line voltage.

Memory device

There are provided a semiconductor memory and an operating method thereof. The semiconductor memory includes: a memory block including a plurality of pages; a peripheral circuit for performing a first erase operation, a program operation, and a second erase operation on the memory block in a write operation on the memory block; and control logic for controlling the peripheral circuit to perform the write operation. The control logic is configured to control the peripheral circuit to erase a plurality of memory cells included in the memory block to a pre-erase state having a threshold voltage higher than a threshold voltage of a target erase state in the first erase operation, and controls the peripheral circuit to erase some memory cells among the plurality of memory cells to the target erase state in the second erase operation.

Semiconductor memory and operating method thereof

A semiconductor memory device is provided. The semiconductor memory device includes memory strings including drain-side memory cells connected between a bit line and a pipe transistor, and source-side memory cells connected between the pipe transistor and a source line, and a peripheral circuit suitable for applying a pipe gate voltage to a pipe gate of the pipe transistor before applying pass voltages to turn on non-selected memory cells among the drain-side memory cells and the source-side memory cells during a read operation.

Semiconductor memory device having memory strings including drain-side and source-side memory cells connected to pipe transistor and peripheral circuit suitable for applying pipe gate voltage to pipe transistor during read operation

Provided is a semiconductor device including a pillar, a gate electrode having a first conductive pattern surrounding the pillar and a plurality of second conductive patterns which protrude from the first conductive pattern and are arranged to be spaced apart from each other, and an insulating pattern interposed between the pillar and the first conductive pattern.

Method of manufacturing transistor and semiconductor device including the same

A semiconductor memory apparatus includes a memory block including memory cells coupled between a bit line and a source line and operating in response to voltages applied to word lines, and a peripheral circuit suitable for performing operations relating to data input and output of the memory cells, wherein the peripheral circuit is suitable for applying a precharge voltage to the bit line when word lines adjacent to a selected word line are set to a floating state.

Growing community of inventors

Incheon, South Korea

Moon Sik Seo