Samsung Electronics Co., Ltd.

Moon-Ho Lee

Woon-sup Choi

Joosung Yun

Joo-sung Yun

Seongseob Shin

Seong-seob Shin

Woonsup Choi

A test apparatus includes a device under test (DUT) configured to exchange data using a serial interface protocol and a test controller configured to receive a binary vector corresponding to a physical layer of the serial interface protocol from an external device and to buffer and transmit the received binary vector to the DUT.

Test apparatus based on binary vector

A test board includes: a board substrate; a device under test (DUT) socket connected to the board substrate and configured to accommodate a semiconductor package; a test controller; a wireless signal unit configured to wirelessly exchange signals with a server; and a wireless power unit configured to be wirelessly charged by an external source and configured to supply electric power to the test controller and the DUT socket, wherein the test controller is configured to independently perform a test on the semiconductor package accommodated in the DUT socket in response to a test pattern command being wirelessly received from the server via the wireless signal unit.

Test board for semiconductor package, test system, and method of manufacturing semiconductor package

Growing community of inventors

Asan-si, South Korea

Moon-Ho Lee