Lg Chem, Ltd

Moon Cheol Shin

Dong Hwan Ryu

Jae Seol Ryu

Yeong Bong Mok

Ho Joon Yoo

Se Ho Shin

Whoon Jeong

Se Hyun Jang

Provided is an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device comprising the same. The encapsulation film comprises an encapsulation layer comprising a moisture adsorbent, and a metal mesh layer formed on the encapsulation layer.

Encapsulation film having moisture adsorbent and metal mesh layer

The present application relates to an encapsulation film, a method for producing the same, an organic electronic device comprising the same, and a method for preparing an organic electronic device using the same, which allows forming a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, and can effectively release heat accumulated inside the organic electronic device and prevent occurrence of bright spots of the organic electronic device.

Encapsulation film

Growing community of inventors

Daejeon, South Korea

Moon Cheol Shin