Samsung Electronics Co., Ltd.

Mooho Lee

Kyunghae Lee

In Gun Kim

Jun Chwae

Jonghoon Won

Kyeong Pang

Kwangmyung Cho

Jongmin Lee

Da-hye Park

Changho Noh

Namsoo Park

Chansu Kim

Byung Hwa Seo

Inki Kim

Hyeonsu Heo

Songwon Hyun

Seungjoon Hwang

Hyejeong Lee

Kyeon Pang

Insu Lee

An amine-based curing agent including a compound represented by Chemical Formula 1, and a composition including the curing agent, and a semiconductor package, and an electronic device prepared with the composition. The definition of Chemical Formula 1 is as described in the detailed description.

Amine-based curing agents, and compositions, semiconductor packages, and electronic devices including the same

A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1.E1-M1-L1-M2-L2-M3-L3-A-L3-M3-L2-M2-L1-M1-E2  Formula 1 In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.

High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same

A highly thermally conductive epoxy compound, and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package, each including the highly thermally conductive epoxy compound. The epoxy compound is represented by Chemical Formula 1 below and has at least one mesogenic naphthalene unit.E-M-L-M-L-M-E&#x2003;&#x2003;Chemical Formula 1 In Chemical Formula 1, at least one of M, M, or M, which are mesogenic units, is a naphthalene unit. M, M, M, L, L, and Eand Eare as defined in the detailed description.

Highly thermally conductive epoxy compound, and composition, material for semiconductor package, molded product, electric and electronic device and semiconductor package including the same

A thermoplastic resin composition including a polylactic acid, a thermoplastic polymer having a lower glass transition temperature than the polylactic acid, a nucleating agent, and a reactive plasticizer, a molded article made therefrom, and a method of preparing the thermoplastic resin composition.

Thermoplastic resin composition, molded article made therefrom, and method of preparing the composition

A polyurethane elastomer including a polymerization product of an amide group-including compound, a polyol compound, a polybasic acid compound, and a diisocyanate compound, a thermoplastic resin composition including the polyurethane elastomer, a molded article made of the thermoplastic resin composition, and a method of preparing the polyurethane elastomer.

Polyurethane elastomer, thermoplastic resin composition comprising the polyurethane elastomer, molded article made of the thermoplastic resin composition, and method of preparing the polyurethane elastomer

A thermoplastic resin composition including a polylactic acid and organic-inorganic composite particles, wherein the composite particles include an inorganic nanoparticle core and a coating layer formed on the core, wherein the coating layer includes a copolymer, and a molded article made therefrom.

Thermoplastic resin composition and molded article made therefrom

A method for preparing a hydrogenation catalyst by mixing a copper salt with colloidal silica to form a precipitate, washing the formed precipitate to remove anions of the copper salt from the precipitate, and impregnating the anion-removed precipitate with an alkali metal to form a hydrogenation catalyst; and a method for preparing a diol from a lactone using the hydrogenation catalyst.

Method for preparing hydrogenation catalyst and method for preparing diols from lactones using the hydrogenation catalyst

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Mooho Lee