Texas Instruments Corporation

Moody K Forgey

Mark A Kressley

Santos Garza

A ceramic header configured to form a portion of an electronic device package includes a mounting portion configured to provide a mounting surface for an electronic device. In addition, the ceramic header includes one or more conductive input-output connectors operable to provide electrical connections from a first surface of the ceramic header to a second surface of the ceramic header. The ceramic header also includes one or more thermally polished surfaces.

Method for packaging a microelectromechanical system (MEMS) device

Ceramic header method

In semiconductor processing, it is desirable to protectively cover the wafer (40) prior to sawing the wafer (40) into individual chips. The compressive nitride protective cover tends to bow the normally flat surface of the wafer (40). If the compressive stress is too great, the wafer (40) and the circuits thereon may be damaged. The laser stress measurement apparatus (10) provides a method for checking the wafer (40) for excess stress without destroying the wafer (40). A light source (12) emits a beam of light onto a reflector (22) which reflects the light onto wafer (40). The light is deflected by wafer (40) back to the reflector (22) and thence to a light detector (52). The light detector (52) is positioned to receive the light in an exact center such that subsequent readings may be taken to determine a change in deflection. The change in deflection is then used in a formula to determine the compressive stress on wafer (40).

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Carrollton, TX, United States of America

Moody K Forgey