Samsung Electronics Co., Ltd.

Moo-Rym Choi

Jae-Goo Lee

Kohji Kanamori

Young-Woo Park

Dong-Chan Kim

Jae-Duk Lee

Chang-Min Choi

Ae-Jeong Lee

Chung-Jin Kim

In a method of operating a nonvolatile memory device, a first sub-block to be erased is selected in a first memory block including the first sub-block and a second sub-block adjacent to the first sub-block, in response to a erase command and an address. The first sub-block includes memory cells connected to a plurality of word-lines including at least one boundary word-line adjacent to the second sub-block and internal word-lines other than the at least one boundary word-line. An erase voltage is applied to a substrate in which the first memory block is formed. Based on a voltage level of the erase voltage applied to the substrate, applying, a first erase bias condition to the at least one boundary word-line and a second erase bias condition different from the first erase bias condition to the internal word-lines during an erase operation being performed on the first sub-block.

Methods of operating nonvolatile memory devices including erasing a sub-block

A semiconductor device is provided. Word lines are formed on a substrate. An air gap is interposed between two adjacent word lines. A channel structure penetrates through the word lines and the air gap. A memory cell is interposed between each word line and the channel structure. The memory cell includes a blocking pattern, a charge trap pattern and a tunneling insulating pattern. The blocking pattern conformally covers a top surface, a bottom surface, and a first side surface of each word line. The first side surface is adjacent to the channel structure. The charge trap pattern is interposed only between the first side surface and the channel structure.

Semiconductor device having vertical channel and air gap, and method of manufacturing thereof

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Yongin-si, South Korea

Moo-Rym Choi