Doosan Corporation

Other

Moo Hyun Kim

Jeong Don Kwon

Do Woong Hong

Dong Hee Jung

Duk Sang Han

The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.

Thermosetting resin composition for frequency, and prepreg, laminated sheet and printed circuit board using same

A thermosetting resin composition for use with high frequencies is provided. The composition includes: (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. It is possible to provide a printed circuit board for use with high frequencies which simultaneously exhibits, inter alia, an outstanding low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, thermal stability and outstanding working properties.

The present disclosure provides: a thermosetting resin composition comprising: (a) bisphenol M-type epoxy resin; (b) bisphenol M-type cyanate ester resin; (c) polyphenylene ether having two or more vinyl groups at both ends of a branched chain, or oligomers thereof; and (d) a cross-linking curing agent, a prepreg comprising the composition, and a printed circuit board. The printed circuit board simultaneously has an excellent low dielectric loss characteristic, a great moisture-absorbing and heat-resistant characteristic, a low thermal expansion characteristic, thermal stability and the like.

Thermosetting resin composition having heat resistance and low dielectric loss characteristics, prepreg using same, and copper clad laminate

The present application relates to a system and method for allowing musicians including composer, arranger, instrumental player and singer to provide music data by stages to complete a popular song or instrumental music. A system for providing music data according to the present invention includes a music data server for transmitting and receiving music data to and from at least four types of musician terminals including a first musician terminal or a composer terminal, a second musician terminal or an arranger terminal, a third musician terminal or an instrumental player terminal and a fourth musician terminal or a singer terminal; and a settlement server for performing settlement transactions related to the music data transmissions between the music data server and the musician terminals.

Growing community of inventors

Yongin-si, South Korea

Moo Hyun Kim