Tektronix, Inc.

Monty Smith

Julie A Campbell

David George Payne

James E Trimble

Garry P Liddell

A high-speed, low-profile logic analyzer test probe has a body of insulating material molded directly onto a narrow elongate substrate having electrical circuitry disposed thereon. The molded insulating material has a notch formed therein for exposing a conductive surface formed on the substrate. The exposed conductive surface is used for making a ground connection between the substrate and the ground of a device under test. The probe may be adapted for use in probe holder for multichannel probing wherein the probe holder has an electrically conductive chip disposed within the probe holder housing for providing the shortest possible ground connections between the ground pins on the device under test and the ground connections on the probes.

High-speed, low-profile test probe

A measurement probe has a probe tip coaxially disposed within one end of a elongate cylindrical outer conductor with the probe tip extending beyond the end of the outer conductor. A body of insulating material surrounds the outer conductor and a portion of the probe tip to provide electrical isolation between the probe tip and the outer conductor. A notch is formed in the insulating material distant from the probe tip to expose the outer conductor for providing an electrical connection between an outer conductor of a removable adapter and the elongate cylindrical outer conductor of the measurement probe. The measurement probe meets all safety standards for use as a floating measurement probe as well as being adaptable for providing a coaxial signal path having a common voltage ground.

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Forest Grove, OR, United States of America

Monty Smith