Compaq Computer Corporation, Inc.

Hewlett Packard Enterprise Development LP

Hewlett-packard Development Company, L.p.

Compaa Computer Corporation

Montgomery C McGraw

Kenneth A Jansen

David A Miller

Darren John Cepulis

Paul R Culley

Dwight D Riley

John S Thayer

Kevin J Brusky

Troy Anthony Della Fiora

John C Barker

James A Rozzi

Kuang-Yi Wu

Alan L Goodrum

John Robert Grady

John W Frederick

Belgie B McClelland

Derrill L Sturgeon

Christopher D Voltz

Curtis R Jones

Drew S Johnson

Charles W Cochran

Ralph K Williamson

Scott C Farrand

Alex Olson

Thomas D Rhodes

Robert S Gready

Karl N Walker

Lazaro D Perez

Elizabeth A Richard

Huong Truong

Long B Sam

Daryl D George

Michael R Griffin

Kurt A Manweiler

Beatrice Dee Pipes

Fernando Macias-Garza

Robert Thomas McClung

Gabriel C Cox

Daniel W Eaton

Roberta A Walton

Jonathan Nalley

Pamela H Williams

Todd W Miller

An apparatus in a first computing device is provided. During operation, the apparatus can present, to a processor of the first computing device, a virtual interface switch (VIS) coupled to an interface port of the processor. The apparatus can present to the processor that a target device, which is reachable via a remote apparatus of a second computing device, is coupled to the VIS. The apparatuses can be coupled via at least a first fabric and a second fabric. A respective fabric may facilitate communication based on a fabric switching protocol. The apparatus can obtain a set of packets, which can be issued from the interface port via the VIS and directed to the target device. The apparatus can then forward, to the remote apparatus, a first subset of the set of packets via the first fabric and a second subset of the set of packets via the second fabric.

Method and system for facilitating high availability in a multi-fabric system

Composable computing architectures with an interconnection fabric to provide high availability and fault tolerance are described. An interconnection fabric routes packets between compute resources, memory resources, and input/output (I/O) resources. A fabric manager is coupled with the interconnection fabric to receive an I/O or memory requirement for a compute workload for a host device, and to map individual I/O or memory resources from the plurality of I/O resources to individual compute resources from the plurality of compute resource and to dynamically map individual I/O resources from the plurality of I/O resources based on received resource requests.

Flexible high-availability computing with parallel configurable fabrics

A system to facilitate automatic data center assembly is described. The system includes a first enclosure, including a first set of components, each component including a component manager to perform a component function and a first enclosure manager, communicatively coupled to each component manager, to perform a discovery of each of the first set of components and discover one or more adjacent enclosures coupled to the enclosure via link cables. The system also includes a system manager to automatically discover the first enclosure via the first enclosure manager and discover each of the first set of plurality of components via an associated component manager.

Automatic component discovery mechanism

Some examples provide a method for automatic network assembly. The following instructions may be used to implement automatic network assembly in a modular infrastructure. Instructions to automatically connect a management port to a management network. Instructions to automatically connect link ports to form a scalable ring. Instructions to automatically connect each modular infrastructure management device to a bay management network port.

Automatic network assembly

An example computing device enclosure can include a first printed circuit board (PCB) that includes a first plurality of components, where a first portion of the first plurality of components that are shorter than a threshold height are positioned on a first side of the first PCB and a second portion of the first plurality of components that are taller than the threshold height are positioned on a second side of the first PCB, and a second printed circuit board (PCB) that includes a second plurality of components, where a first portion of the second plurality of components that are shorter than the threshold height are positioned on a first side of the second PCB and a second portion of the second plurality of components that are taller than the threshold height are positioned on a second side of the second PCB.

Printed circuit board orientations

A converged infrastructure manager comprises a circuit board, a processor connected to a first side of the circuit board, a solid state drive connected to the circuit board, a first connector extending from the first side of the circuit board, a second connector extending from a second side of the circuit board, a first dual in-line memory module connected to the first connector and a second dual in-line memory module connected to the second connector.

Converged infrastructure manager

In one implementation, a system for a redundant power extender includes a first automatic transfer switch comprising a number of in-ports coupled to a first power distribution unit and a second power distribution unit, wherein the first automatic transfer switch comprises an out-port coupled to a first side of a device and a second automatic transfer switch comprising a number of in-ports coupled to the first distribution unit and the second power distribution unit, wherein the second automatic transfer switch comprises an out-port coupled to a second side of the device with intelligence to allow 4+4 power redundancy from a system otherwise limited to 3+3 power redundancy.

Redundant power extender

In one example in accordance with the present disclosure, a system is provided. The system includes a first subsystem and a second subsystem, connectable to each other via a passive cable, and each connected to a high-level management tool. Each subsystem includes a signal driver/receiver capable of sending and receiving data and signals over the passive cable and a connection discovery engine to access low-level power up/down controls of the signal driver/receiver. The connection discovery engine is to, via physical layer communication, send a local unique identifier (ID) of the particular signal driver/receiver over the passive cable. The connection discovery engine is further to, via physical layer communication, receive, over the passive cable, a remote unique ID of the signal driver/receiver in the other connected subsystem. The connection discovery engine is further to send the local unique ID and the remote unique ID to the high-level management tool.

Discovering connection of passive cables

A server includes an electronic component, manager baseboard management controller (BMC), and a device hardware agent. The device hardware agent monitors operation of the electronic component and provides updates to the electronic component without utilizing a software agent.

Device hardware agent

An on-board input and management device is disclosed. In an exemplary implementation, a method of managing a blade computing system may include monitoring current systems status in a blade computing system with an integrated management controller. The method may also include using the integrated management controller for user interaction to monitor and modify configuration of a plurality of modules in the blade computing system. In an exemplary embodiment, all of the modules in the blade computing system may be monitored and managed.

On-board input and management device for a computing system

A computer-implemented method for monitoring temperature of a blade server to determine ambient temperature includes the steps of determining temperatures of each of any installed processing components, and determining a temperature of an administrator component. If there are no processing components installed in the computer chassis, the method reports the ambient temperature as the temperature of the administrator component, and if there are processing components installed in the computer chassis, the method reports the highest temperature value of a processing component which is lower than the temperature value of the administrator module as the ambient temperature.

Method for monitoring temperature of computer components to determine ambient chassis temperature

A computer-implemented method for cooling a modular computer system having multiple cooling devices and multiple heat-generating modules is disclosed. The method includes the steps of determining the number of cooling device installed in the system; determining the positions of the installed cooling devices; applying predefined cooling device placement rules and signaling an error condition if a cooling device is in an unacceptable location; determining locations of all installed heat-generating modules; and applying the predefined cooling device placement rules and signaling an error condition if an installed heat-generating module is in an unacceptable location.

Method for controlling system temperature

Growing community of inventors

Magnolia, TX, United States of America

Montgomery C McGraw