Alpha Assembly Solutions Inc.

Alpha Metals, Inc.

Monnir Boureghda

Oscar Khaselev

Bawa Singh

Michael T Marczi

Nitin Vithalbhai Desai

Anna Lifton

Bin Mo

Siuli Sarkar

Ranjit Pandher

Rahul Raut

Sathish Kumar

Sutapa Mukherjee

Ravi Bhatkal

Nirmalya Kumar Chaki

Remya Chandran

Pavan Vishwanath

Morgana De Avila Ribas

Ashok Pachamuthu

Shamik Ghosal

Carl Bilgrien

Morgana Ribas

Mike Marczi

Matthew James Siebenhuhner

Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

Sintering materials and attachment methods using same

A method of making a combined sinter-ready silver film and carrier comprises the steps of: a) creating a carrier comprising designed openings; b) casting a silver film layer into the designed openings, for example casting a silver paste; and c) drying the carrier and silver film layer to form the combined sinter-ready silver film and carrier. The carrier may comprise a plastic carrier, which may be created by permanently bonding two plastic films, using a plasma bonding process or using a temperature stable glue. The carrier may comprise a stencil layer and a backing layer. The stencil layer may define the designed openings. The backing layer may be configured for sealing a bottom of the designed openings, wherein at the start of step b), a top of the designed openings may be open for receiving the cast silver film layer.

Sinter-ready silver films

Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300&#xb0; C. or less to attach the die to the substrate. Devices produced using the methods are also described.

Methods for attachment and devices produced using the methods

A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.

Composite and multilayered silver films for joining electrical and mechanical components

A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

Sintering paste

Materials for die attachment such as silver sintering films may include reinforcing, modifying particles for enhanced performance. Methods for die attachment may involve the of such materials.

Sintering powder

Methods for attachment of a die to a substrate are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300&#xb0; C. or less to attach the die to the substrate.

Methods of attaching a die to a substrate

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East Stroudsburg, PA, United States of America

Monnir Boureghda