Applied Materials, Inc.

Mohsin Waqar

Juan Carlos Rocha-Alvarez

Ganesh Balasubramanian

Jianhua Zhou

Kwangduk Douglas Lee

Hari K Ponnekanti

Prashant Kumar Kulshreshtha

Dale Robert Du Bois

Kalyanjit Ghosh

Jeongmin Lee

Paul Dennis Connors

Venkatanarayana Shankaramurthy

Karthik Thimmavajjula Narasimha

Saptarshi Basu

Liliya Krivulina

Brett Berens

Hiroyuki Ogiso

Rick Gilbert

Paul Zachary Wirth

Marvin L Freeman

Todd J Brill

Paul E Fisher

Ilias Iliopoulos

Charles Gregory Potter, Sr

Ali Utku Pehlivan

Implementations disclosed describe an inspection device capable of being transferred by a robot blade into a processing chamber of a manufacturing machine, the inspection device comprising an optical sensor to detect light reflected from a target located within the processing chamber, wherein the optical sensor is to output, to a processing device, a signal representative of a state of a region of a surface of the target.

Methods and systems of optical inspection of electronic device manufacturing machines

A method for finding a center of a process kit and/or a process kit ring is provided. An object placed on an end effector is moved past a sensor of a manufacturing system. A first signal indicating a current shape of object is received from the sensor of the manufacturing system. A determination is made whether the first signal corresponds to a second signal indicating a predefined shape for a process kit and/or a process kit carrier. In response to a determination that the first signal corresponds to the second signal, a coordinate correspondence is determined between coordinates of a center of the object and coordinates of a center of the end effector. The determined coordinate correspondence indicates whether a current placement of the object on the end effector satisfies a target placement criterion.

Centerfinding for a process kit or process kit carrier at a manufacturing system

Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.

Loadlock integrated bevel etcher system

An electronic device manufacturing system includes a motion control system for calibrating a gap between surfaces of process chamber or loadlock components by moving those component surfaces into direct contact with each other. The component surfaces may include a surface of a substrate and/or a substrate support and a surface of process delivery apparatus, which may be, e.g., a pattern mask and/or a plasma or gas distribution assembly. The motion control system may include a motion controller, a software program executable by the motion controller, a network, one or more actuator drivers, a software program executable by the one or more actuator drivers, one or more actuators, and one or more feedback devices. Methods of calibrating a gap via direct contact of process chamber or loadlock component surfaces are also provided, as are other aspects.

Systems and methods of gap calibration via direct component contact in electronic device manufacturing systems

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Alameda, CA, United States of America

Mohsin Waqar