Intel Corporation

Mohit Bhatia

Omkar G Karhade

Nitin A Deshpande

Anurag Tripathi

Debendra Mallik

Sairam Agraharam

Edvin Cetegen

Steve S Cho

Manish Dubey

Takeshi Nakazawa

Jinhe Liu

Kristof Darmawikarta

Wei Ey Li

Gang Duan

Wei-Lun Kane Jen

Bai Nie

Jason M Gamba

Malavarayan Sankarasubramanian

Jingyi Huang

Jan Krajniak

Disclosed herein are microelectronic structures including bridges, and related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate with first and second metal layers; a cavity in the substrate, where a portion of the first and second metal layers, are exposed with the portion of the first metal layer partially overlapping the portion of the second metal layer; and a bridge component in the cavity, having a first conductive contact at a first face and a second conductive contact at a second face opposing the first face, the second face towards a bottom surface of the cavity, the portion of the first metal layer is between the second face of the bridge component and the portion of the second metal layer, and the second conductive contact is electrically coupled to the portion of the second metal layer in the cavity.

Microelectronic structures including bridges

Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate including a first metal layer and a second metal layer; a cavity in the substrate, wherein a portion of the first metal layer in the substrate and a portion of the second metal layer in the substrate are exposed in the cavity; and a bridge component in the cavity, the bridge component includes a first conductive contact at a first face and a second conductive contacts at an opposing second face, wherein the second face of the bridge component is between the first face of the bridge component and a bottom surface of the cavity in the substrate, and wherein the second conductive contact is electrically coupled to the portion of the first metal layer in the cavity.

Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects

Growing community of inventors

Chandler, AZ, United States of America

Mohit Bhatia