Delphi Technologies, Inc.

Coolit Systems, Inc.

Gm Global Technolgoy Operations, Inc.

Mahle International Gmbh

Mohinder Singh Bhatti

Ilya Reyzin

Shrikant Mukund Joshi

Debashis Ghosh

Prasad S Kadle

Russell S Johnson

Mingyu Wang

Mark Joseph Parisi

Prasad Shripad Kadle

Donald T Morelli

Donald John Enzinna

Lin-Jie Huang

Gary Scott Vreeland

John Lawrence Pawlak, Iii

Gary Lynn Eesley

Steven R Falta

Andrew R Hayes

David P Rusch

James Allen Baker, Jr

Scott Edward Kent

Suresh Deepchand Shah

Edward Wolfe, Iv

James A Bright

David A Southwick

Wayne Oliver Forrest

Frederick Vincent Oddi

Mark James Zima

John Paul Telesz

Lawrence P Scherer

Sunil S Mehendale

Elliott D Keen

Patrick Mitchell Griffin

John F Wurster

Dennis Lee Farley

Eugene C Boyer

Karl P Roetsch

Stephen Michael Vetter

Kurt Dale Hollasch

Gary S Vreeland

Steven Falta

Edward Wolfe Iv

The invention is a method for producing a heat exchanger assembly including the steps of extruding a plastic and an adhesive from a co-extrusion die into a plurality of tubes spaced from each other with each tube having an adhesive disposed on its exterior surface. A plurality of corrugated air fins are serially fed into the co-extrusion die and spaced from each other by a predetermined space and ejected between adjacent tubes with the corrugations extending transversely between the tubes. The adhesive is then cured to secure the tubes to the air fins. The method proceeds by cutting the tubes at each predetermined space with a guillotine shear to produce a plurality of unified heat exchanger cores. The ends of the tubes of each core are inserted into tube slots in manifolds, and the tubes and manifolds are adhesively secured together to define a heat exchanger assembly.

Continuous manufacturing process for metal-plastic hybrid heat exchanger

A heat exchanger assembly includes a pair of outer headers each defining an outer cavity and a pair of inner headers each defining an inner cavity. Each inner header is disposed in one of the outer headers, and each header defines a plurality of header slots. A plurality of first fluid tubes extend between the outer headers from one of the header slots of each outer header to fluidly interconnect the outer cavities defined by the outer headers and a plurality of second fluid tubes are interleaved with the first refrigerant tubes and extend between the outer headers and through one of the header slots of each outer header and through the associated outer cavities defined by the outer headers and to the one of the header slots of each inner header to fluidly interconnect the inner cavities defined by the inner headers.

High performance three-fluid vehicle heater

An integrated liquid cooling unit comprising a liquid pump and a U-shaped flat tube. An adapter rigidly connects and establishes fluid communication between the pump and the tube creating an integrated unit for cooling an electronic chip via a closed loop. Heat is rejected from the coolant through cooling fins disposed between the legs of the U-shaped tube to passing air being propelled by a blower assembly.

Integrated liquid cooling unit for computers

The invention provides for an orientation insensitive heat exchanger assembly for cooling an electronic device comprising a hermetically sealed housing defining a boiling chamber and two condensing chambers. A partition is disposed in the boiling chamber and defines two sets of alternating channels extending in overlapping relationship to one another and with one set of alternating channels open to one of the condensing chambers and the other set of alternating channels open to the other condensing chamber for sealing the condensing chambers from one another. Coolant is maintained in each of the condensing chambers. In operation, if the thermosiphon is tilted with one side lower than the other, the channels open to the lower side are empty of coolant into the lower condensing chamber while the channels open to the opposite upper side hold the coolant over the entire boiling chamber aligning with an electronic device to continue cooling.

Thermosiphon for laptop computers comprising a boiling chamber with a square wave partition

Heat exchanger

A heat exchanger having a plurality of tubes that define refrigerant passages extending vertically from a lower end to an upper end. A bottom header is in fluid communication with the passage at the lower end of the tube, and a top header is in fluid communication with the passage at the upper end of the tube. A plurality of plates extends rearwardly from the tubes to a distal edge. Adjacent plates extending from adjacent tubes are closed off at the distal edges by a connector, and adjacent plates extending from the same tube have a rear opening between the distal edges for receiving air into the assembly. A plurality of orifices is disposed along the plates to allow air from the rear opening to flow downstream between the tubes. A water tank and wicking material are provided for wetting the plates.

High efficiency evaporatively cooled condenser

The invention provides a heat exchanger assembly having a housing which defines a boiling chamber extending along an axis between opposite ends. A plurality of first condensing tubes extend axially and downwardly in one direction at a first predetermined angle to and below the axis (A) from the housing and a plurality of second condensing tubes extend axially and upwardly in the opposite direction at the same predetermined angle to and above the axis (A) from the housing. The volume of refrigerant in the housing is greater than the volume of the second condensing tubes and the volume of the boiling chamber.

Orientation insensitive thermosiphon capable of operation in upside down position

A refrigeration assembly includes a pair of refrigerated chambers defined within a working chamber. The refrigerated chambers include channel walls extending parallel to one another and spaced apart, and first and second panels extending channel walls to define a working channel for separating the working chamber into sub-chambers. Apertures defined in the panels allow airflow from the sub-chambers into the working channel, and a supply of water wets the panels and a first section of the refrigerated chambers. Air enters the sub-chambers and flows over the first sections of the refrigerated chambers for direct evaporative cooling. A portion of the air bleeds through the apertures and evaporates water from the panels prior to flowing over the second sections of the refrigerated chambers for indirect evaporative cooling.

Evaporative cooler

An automotive air conditioning system is disclosed comprising an evaporative cooler in series with the conventional vapor compression system. The evaporative cooler comprises an array of dry channels and a contiguous array of wet channels. The primary air stream to be conditioned by the evaporator of the conventional air conditioning system is preconditioned by the evaporative cooler by lowering its dry bulb temperature without changing its absolute humidity. An evaporator core is supported downstream of the evaporative cooler for receiving the primary air from the dry channels and thereby produces liquid condensate. The system is distinguished by conducting the liquid condensate from the evaporator core to the wicking tank for use in the wet channels of the evaporative cooler.

Evaporative cooler assisted automotive air conditioning system

A thermosiphon cooling assembly includes a plurality of hairpin condenser tubes that extend into openings of a boiling chamber for collection of refrigerant vapor from a boiler housing. The distal ends of the tubes extend into the chamber from a cover the least distance midway between the ends of the boiler housing and increase in distance in opposite directions toward the ends. The hairpin tubes are in groups with each tube in a group having the same length and the groups having respectively different lengths and at least one group includes more than one tube.

High performance compact thermosiphon with integrated boiler plate

A thermoelectric heat transfer system is provided. The thermoelectric heat transfer system comprises a coolant circuit with a pump circulating coolant through the circuit. A first heat exchanger is in fluid communication with the coolant circuit to remove heat from the coolant. At the same time, a second heat exchanger is in fluid communication with the coolant circuit. Thermoelectric modules (TEMs) are integrated into the second heat exchanger to create a temperature differential between fins and conduits of the second heat exchanger. The coolant flows through the conduits to draw heat from the TEMs, while a fan assembly conveys air through the fins into a climate-controlled area to cool the climate-controlled area to a desired temperature. In other embodiments, a sleeve acts as the second heat exchanger. The sleeve is adapted to receive and cool beverage containers and like items.

Thermoelectric heat transfer system

Three embodiments of a heat exchanger assembly for cooling an electronic device are shown respectively in FIGS.-andand each comprises a flange, a dome, a plurality of condensing tubes, a shroud, and a boiler plate. In the first embodiment shown in FIG.the dome is semi-spherical in shape and the distance measured axially along the center axis equals the distance measured laterally from or perpendicular to the center axis. In the second and third embodiments shown in FIGS.and,respectively, the distance measured axially along the center axis is greater than the distance measured laterally from or perpendicular to the center axis. The domes in the second and third embodiments are an ellipsoid and a semi-logarithmic body, respectively. In all embodiments, a plurality of condensing tubes aligned in fan rows and arced rows extend from the dome to distal ends to facilitate more-efficient heat transfer.

Domed heat exchanger (porcupine)

An evaporatively pre-cooled seat assembly comprising a seat cushion, an auxiliary cooler, and an evaporative cooler. The evaporative cooler includes a plurality of parallel tubular dry channels and a plurality of tubular wet channels. The dry channels and wet channels are arranged such that they alternate from dry channel to wet channel from channel to channel. Each of the channels is defined by two parallel side walls, a top, and a bottom. A first plurality of dry channels defines a plurality of apertures in the side walls thereof for conveying air out of the respective dry channel and into an adjacent wet channel. A second plurality of dry channels alternates with the first plurality and is disposed between two wet channels and defines a plurality of cooler apertures in the tops thereof for conveying cooled air out of the second plurality of alternating dry channels and to the auxiliary cooler.

Evaporatively pre-cooled seat assembly

A fluid heat exchanger unit cools an electronic device with a cooling fluid supplied to an upper portion of a cooling housing. A refrigerant is disposed in a lower portion of the cooling housing for liquid-to-vapor transformation. A partition divides the upper portion of the cooling housing from the lower portion. A heat rejecter is disposed on and above the upper wall of the cooling housing with a first header extending from and in fluid communication with the liquid coolant outlet. A second header extends upwardly from a rejecter outlet. A plurality of first tubes extend between and in fluid communication with the first header and the second header with a plurality of first air fins disposed between the upper wall and the first tubes. A single unit defines both the cooling housing and the air cooled heat rejecter to thereby allow the manufacture of the unit in a single process with the attendant reduction in shipping, handling and installation.

Integrated liquid cooled heat sink for electronic components

Two embodiments of a heat exchanger assembly for cooling an electronic device are shown respectively in FIGS.andand each comprises a housing, a plurality of high fins, a plurality of low fins, a nozzle plate, an inlet, at least one outlet, a primary nozzle, and a plurality of secondary nozzles. In the first embodiment shown in FIG.the housing and the nozzle plate are circular in shape. In the second embodiment shown in FIG.the housing and the nozzle plate are rectangular in shape. Both embodiments include a plurality of secondary nozzles that are aligned outwardly of the primary nozzle and the center axis of the nozzle plate. The secondary nozzles direct the flow of the cooling liquid outwardly of the primary nozzle from the center thus creating an overall system pressure drop lower than that of other assemblies without a plurality of secondary nozzles.

Impingement cooled heat sink with low pressure drop

Growing community of inventors

Amherst, NY, United States of America

Mohinder Singh Bhatti