National Semiconductor Corporation

Mohd Sabri Bin Mohamad Zin

Ken Pham

Peng Soon Lim

Terh Kuen Yii

Poh Chuan Fong

Woo Kuan Yee

Peter Chin Ting Soon

An arrangement is described that includes a compartmentalized structure having a multiplicity of compartments defined by associated links and each having a bottom surface. The arrangement also includes a multiplicity of fiducials. The fiducials are positioned at top surfaces of the links that surround each compartment such that each compartment includes at least one associated fiducial at the top surface of an adjacent link that defines the compartment. The arrangement further includes an adhesive layer positioned on the bottom surface of each compartment. The at least one fiducial that surrounds each compartment is suitable for use by a vision system to identify the location of the associated compartment.

Waffle pack

An improved leadframe panel suitable for use in packaging IC dice is described. The described leadframe panel is configured such that the amount of leadframe material that is removed during singulation of the leadframe panel is reduced.

Leadframe panel

Growing community of inventors

Melaka, Malaysia

Mohd Sabri Bin Mohamad Zin