Freescale Semiconductor,inc.

Mohd Rusli Ibrahim

Lan Chu Tan

Ruzaini B Ibrahim

Nor Azam Man

Kee Cheong Fam

A pressure sensor device includes a gel retainer that is mounted or formed on a substrate. The gel retainer has a cavity and a pressure sensing die is mounted inside the cavity. The die is electrically connected to one or more other package elements. A pressure-sensitive gel material is dispensed into the cavity to cover an active region of the pressure sensing die. A mold compound is applied on an upper surface of the substrate outside of the gel retainer.

Pressure sensor device with gel retainer

A BGA type packaged integrated circuit (IC) die has an exposed coronal heat spreader. The die, which is attached to a substrate, is encapsulated in a central segment of molding compound. The central segment is laterally surrounded by, and separated by a moat from a ring segment of molding compound, to a form a slot. The coronal heat spreader is inserted into the slot to cap the central segment. The coronal heat spreader is attached to the substrate and to the central segment with thermal glue. In operation, at least some of the heat generated by the die is dissipated through the coronal heat spreader.

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Shah Alam, Malaysia

Mohd Rusli Ibrahim