Intel Corporation

Mohd Muhaiyiddin Bin Abdullah

Eng Huat Goh

Khang Choong Yong

Tin Poay Chuah

Wil Choon Song

Chee Ling Wong

Jackson Chung Peng Kong

Xiang Li

Hao-Han Hsu

Kuan-Yu Chen

Chung-Hao Chen

Yun Ling

A system for board-to-board interconnect is described herein. The system includes a first printed circuit board (PCB) having a first recess along a first edge of the first PCB that exposes a first solder pad on a layer of the first PCB. The system also includes a second PCB having a second recess along a second edge of the second PCB that exposes a second solder pad on a layer of the second PCB. The second recess is complementary to the first recess to allow the first PCB to mate with the second PCB. The first solder pad is aligned with the second solder pad when the first PCB is mated with the second PCB. The system additionally includes an assembly configured to electronically couple the first solder pad with the second solder pad.

Board to board interconnect

Techniques for routing signal traces in a circuit board are described. An example of an electronic device in accordance with the described techniques includes a circuit board comprising a plurality of conductive layers. The conductive layers include a signal layer and a reference plane. The signal layer includes signal traces and the reference plane includes an additional signal trace.

Circuit board having a signal layer with signal traces and a reference plane with an additional signal trace larger than the signal traces

Growing community of inventors

Kepala Batas, Malaysia

Mohd Muhaiyiddin Bin Abdullah