Visteon Global Technolgoies, Inc.

Ford Motor Company Limited

Visteon Global Tech., Inc

Other

Visteon Corporation

Mohan R Paruchuri

Lakhi Nandlal Goenka

Achyuta Achari

Dongkai Shangguan

Jay DeAvis Baker

Vivek Amir Jairazbhoy

Delin Li

Robert Edward Belke

Thomas Bernd Krautheim

Andrew Zachary Glovatsky

Lawrence LeRoy Kneisel

Brenda Joyce Nation

Prathap Amerwai Reddy

Vladimir Stoica

Bharat Z Patel

Cuong Van Pham

Richard Keith McMillan

Robert Joseph Gordon

Prathap Amervai Reddy

Edward Paul McLeskey

Michael Allen Howey

Sunil Palakodati

Daniel Phillip Dailey

Marc Alan Straub

Jun Ming Hu

Ram S Raghava

Lakhi Nandial Goenka

Karen Lee Chiles

Hong Zhou

Alice Dawn Zitzmann

Raja-Sheker Bollampally

Vivek Jairazboy

William F Quilty, Jr

Udit Patel

Puqiang Zhang

Daniel Kline

Balaji Bharadwaj

Vivek Amir Jalrazbhoy

Abha Tiwari

A methodfor making multi-layer electronic circuit boardshaving metallized apertures

Method of making a printed circuit board

A center console for a motor vehicle comprising a stationary housing mounted within the vehicle. The housing includes an open center defined between opposing ends and has a console body mounted within the open center of the housing. The console body is rotatable about a longitudinal axis running through the console body and is mounted such that an operator may remove the body from the frame. Also, at least two longitudinal side walls of the rotating body are visible within the open center and the console body may be rotated such that alternate side walls may be positioned in an uppermost position with respect to the center console. Thus, a user may exchange the console body for another and access multiple sides of the console body, regardless of which is in the uppermost position.

Pivotable and interchangeable console

The present invention is generally directed towards a flip chip assembly. In particular a new bonding process for bonding an electronic component to the substrate is disclosed. The method comprises the steps of forming at least one solder pad on the electronic component and forming at least one bond pad on the substrate wherein the at least one bond pad has a top layer formed of a metal. Placing an underfill film on top of the at least one bond pad and heating the electronic component and the substrate. Moving the electronic component towards the substrate such that the at least one solder pad is aligned on top of the at least one bond pad and finally forming a bond between the at least one solder pad and the top layer of the at least one bond pad.

Flip-chip bonding method

A multi-layer circuit board having apertures that are selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by a polymeric material. Each of the apertures selectively receives an electrically conductive material.

Circuit board with air-bridge

A multi-layer electronic circuit board designhaving selectively formed apertures or cavities, and which includes grooves or troughswhich are effective to selectively entrap liquefied adhesive material, thereby substantially preventing the adhesive material from entering the apertures

Electrical circuit board and a method for making the same

A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes fixing the die to the substrate, interconnecting the electronic die to an at least one bonding pad on the substrate to form an electrical connection, coating the interconnects and the electronic die with an electrically insulating coating, and covering the electronic die with a low temperature melting metal. Thus, the method of the present invention improves the reliability of the electronic die.

Method for attaching a die with a low melting metal

A method for making a multi-layer electronic circuit board including the steps of forming at least one protuberance upon an electrically conductive member and adding additional electrically conductive layers of material to the member while selectively extending the protuberance within the layers , thereby forming a circuit board . A portion of the formed circuit board may be etched in order to selectively create air-bridges or interconnection portions

Circuit board and a method for making the same

A method for making a multi-layer circuit board having apertures which may be selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by material Each of the apertures selectively receives electrically conductive material

Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material

A method for making a multi-layer circuit board having at least one electrically conductive interconnection portion or &ldquo;via&rdquo; which extends within the board and at least one air-bridge The method includes the steps of forming protuberances upon a core member attaching pre-circuit assemblies to the core member thereby forming the circuit board while concomitantly and selectively extending at least one of the protuberances within the formed circuit board

In conventional ETM circuit structures a pin connector in which the pin is etched from the ETM substrate and the mating cavity is etched from the ETM substrate to be mated. The connector utilizes the subtractive ETM structure processing to define any one of several pin-cavity configurations. The pin serves as an anchor with the metallurgical bonds with solder in the cavity that forms on the copper surfaces of the ETM circuit structure to give good mechanical strength to the connection. In particular four different configurations of interconnections are shown and described.

Method for fabricating connectors for interconnecting etched tri-metal circuit structures

A method for making a multi-layer electronic circuit board having at least one electrically conductive protuberance which forms a &ldquo;via&rdquo; and which traverses through the various layers of the electric circuit board , and further having at least one interconnection portion which supports a wide variety of components and interconnection assemblies.

A device for producing an electro-motive force is disclosed. The device includes a cover for creating a liquid seal, an electrolyte contained within the cover for creating an ionic transfer path (medium), and an etched tri-metal board (substrate). The etched tri-metal board has a first conductive layer, a second conductive layer and a third conductive layer. The first, second and third conductive layers are selectively etched to form a cathode and an anode. The cover is sealed against the substrate and filled with an electrolyte to form an electrical device, such as a battery.

ETM based battery

A method for making multi-layer electronic circuit boards having metallized apertures which may be selectively and electrically grounded or isolated from an electrical ground plane.

Method for making an electrical circuit board

The present invention is generally directed grounding an electrical connection to a magnesium cross beam of a motor vehicle. In order to ensure proper grounding, the cross beam is provided with a copper connector. The connector defines a first aperture. An electric circuit is preferably traced on a plastic substrate, where the substrate defines a second aperture. The substrate is placed on top of the cross beam such that the first aperture and the second aperture are aligned with each other. An attaching means such as screws is inserted through the first aperture to the second aperture such that the substrate is attached to the cross beam. In order to prevent the movement of the substrate relative to the cross beam the second aperture is provided with a washer.

Electronic circuit to MG beam grounding method

A method of making an article, such as an electrical connector includes an injection-molded plastic substrate and a pattern of injection-molded metal conductors supported on and mechanically interlocked with the substrate, wherein one of the substrate and the conductors is over-molded onto the other of the substrate and the conductors.

Growing community of inventors

Canton, MI, United States of America

Mohan R Paruchuri