Other

Motorola Corporation

Sumitomo Electric Interconnect Products, Inc.

Mohan Lal Sanduja

Carl Horowitz

Paul Thottathil

Ella Mayslich

James Price Letterman, Jr

Reginald K Asher

Felicia B Dragnea

Reginald K Asher, Ii

A composition and method that provides a chemically grafted coating onto a substrate. The composition comprises an acrylate and a grafting initiator. The acrylate may be a waterborne urethane acrylate. The composition may also comprise resistance agents, adhesion agents, UV curing photoinitiators, defoaming agent, and/or deglossing agents. The substrate may be any wood or plastic, but works well with heat shrinkable polyolefin tubing. The composition may also be quick curing such that the coating from the composition may be cured under a D bulb and an H bulb at a rate of 100-160 feet/minute. The coating on the substrate resists delamination and wear. The coating may have indicia printed on the coating, the indicia being composed from ink or other printable materials.

Chemical grafting onto a substrate and coating composition

A composition and method that provides a chemically grafted coating onto a substrate. The composition comprises an acrylate and a grafting initiator. The acrylate may be a waterborne urethane acrylate. The composition may also comprise resistance agents, adhesion agents, UV curing photoinitators, defoaming agents, and/or deglossing agents. The substrate may be any wood or plastic, but works well with heat shrinkable polyolefin tubing. The composition may also be quick curing such that the coating from the composition may be cured under a D bulb and an H bulb at a rate of 100-160 feet/minute. The coating on the substrate resists delamination and wear. The coating may have indicia printed on the coating, the indicia being composed from ink or other printable materials.

A polymeric organic coating (24) used to package a semiconductor component (10) increases voltage isolation, decreases thermal resistance, and increases scratch and abrasion resistance for the semiconductor component (10). The coating (24) is applied to a leadframe (14) of the semiconductor component (10) using a chemical grafting process that involves the use of monomers, prepolymers, a catalyst, a graft initiator, and other ingredients. The coating (24) forms a polymeric organic film that is chemically bonded to the surfaces of the leadframe (14). The chemical grafting process produces a chemical bond, which improves adhesion between the coating (24) and the leadframe (14).

Method of manufacturing semiconductor component

Growing community of inventors

Flushing, NY, United States of America

Mohan Lal Sanduja