International Business Machines Corporation

Globalfoundries Inc.

Mohammed S Shaikh

S Jay Chey

Timothy Charles Krywanczyk

Cornelia Kang-I Tsang

Matthew T Tiersch

Dustin M Fregeau

Donna S Zupanski-Nielsen

Aparna Prabhakar

Pavan Samudrala

Steven Alan Cordes

Vijayeshwar Das Khanna

David Lewis Gardell

Sherif Ahmed Goma

Matthew J Farinelli

Gary H Irish

John F Hagios

Gene T Patrick

Francis E Froebel

Douglas L Lumbra

Ronald Richard Breton

Michael David Fregeau

A mechanism to attach a die to a substrate and method of use are disclosed. The vacuum carrier includes a frame composed of material compatible with solder reflow process. The vacuum carrier further includes a vacuum port extending from a top surface to an underside surface of the frame. The vacuum carrier further includes a seal mechanism provided about a perimeter on the underside surface of the frame of the vacuum carrier. The frame and seal mechanism are structured to maintain a flatness of a die attached to the vacuum carrier by a vacuum source during the solder reflow process.

Mechanism to attach a die to a substrate

An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

High performance compliant wafer test probe

A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.

Silicon chicklet pedestal

Method of forming silicon chicklet pedestal

An apparatus for testing integrated circuit devices includes a probe device having a plurality of probes, a first substrate including a product substrate having a first surface and an array of electrical contacts disposed on the first surface thereof, and a second substrate disposed between the probes and the first substrate for electrically coupling the probes to corresponding electrical contacts disposed on the first surface of the product substrate.

Structure for coupling probes of probe device to corresponding electrical contacts on product substrate

A space transformer including a body; a ground conductor within the body; a power conductor within the body, the power conductor adapted to be at a higher voltage level than a voltage level of the ground conductor; and one or more decoupling capacitors physically located within the body and electrically connected between the ground conductor and the power conductor.

Wafer test space transformer

The present invention provides a method for forming an improved lead-on chip semiconductor module and an improved module of this type. In a lead-on chip semiconductor device, a semiconductor chip which has a major surface having input and output bonding pads thereon, is secured to a lead frame having a plurality of leads adjacent the bonding pads by means of bonding wires connecting a respective one of the leads to a pad on the chip. A coating of dielectric material having a Young's modulus in the range of about 10 psi to about 500 psi is disposed around the entire length of each of the wires and over the pads and over the portion of the respective leads to which the wires are connected to act as a stress buffer. This material preferably has a T.sub.g of at least as low as -40.degree. C. Also preferably this package is encapsulated with conventional encapsulant.

Encapsulated semiconductor chip module and method of forming the same

An air mixer cool plate (100) for dissipating heat from a plurality of heat-generating elements (22) positioned in an air stream (26). The plate is made from a material having a thermal conductivity preferably ranging from 1 to 500 watts/meter-K and is designed to be positioned to contact the top surfaces of the heat-generating elements. The plate includes a plurality of apertures (106, 108) and a plurality of upstanding air deflectors (110). The apertures and deflectors are arranged so that when the plate is supported in predetermined relation to the heat-generating elements and the air stream, the plate will cause the air stream to be deflected so as to flow in intimate contact with the elements, thereby carrying heat away from the elements by convection and conduction.

Air mixer cool plate

Growing community of inventors

Essex Junction, VT, United States of America

Mohammed S Shaikh