Infineon Technologies Ag

Mohammed Reza Hussein

Frank Pueschner

Thomas Spoettl

Siegfried Hoffner

A chip card substrate is provided that includes a first polymer layer including a first polymer material. The chip card substrate further includes an intermediate layer disposed over the first polymer layer and including polyolefin including a plurality of micro pores, an adhesive layer disposed over the intermediate layer and including an adhesive, and a second polymer layer disposed over the adhesive layer and including a second polymer material different from the first polymer material.

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Wuppertal, Germany

Mohammed Reza Hussein